2024
DOI: 10.3390/mi15030300
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Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density

Myeongho Park,
Bin Yoo,
Myeonghwan Hong
et al.

Abstract: This manuscript presents a comprehensive study on the assembly of microchips using fluidic self-assembly (FSA) technology, with a focus on optimizing the spacing between binding sites to improve yield and assembly. Through a series of experiments, we explored the assembly of microchips on substrates with varying binding site spacings, revealing the impact of spacing on the rate of undesired chip assembly across multiple sites. Our findings indicate a significant reduction in incorrect assembly rates as the spa… Show more

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