Optimized multi-floor throughflow micro heat exchangers

Abdoli, Abas; Dulikravich, George S.

doi:10.1016/j.ijthermalsci.2013.12.008

Cited by 8 publications

(3 citation statements)

References 18 publications

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“…Abdoli and Dulikravich [11] performed multi-objective optimization for four-layer branching microchannel configurations with 67 design variables to improve heat removal and decrease temperature nonuniformity and coolant pumping pressure drop. They also numerically optimized the multilayer through-flow microchannels for heat fluxes up to 800 W cm À2 [12]. Genetic algorithms have been used by Wei and Joshi [13] to perform single objective optimization in order to minimize overall thermal resistance.…”

Section: Introductionmentioning

confidence: 99%

Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

Abdoli

Dulikravich

Vasquez

et al. 2015

Journal of Electronic Packaging

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Two-layer single phase flow microchannels were studied for cooling of electronic chips with a hot spot. A chip with 2.45 × 2.45 mm footprint and a hot spot of 0.5 × 0.5 mm in its center was studied in this research. Two different cases were simulated in which heat fluxes of 1500 W cm−2 and 2000 W cm−2 were applied at the hot spot. Heat flux of 1000 W cm−2 was applied on the rest of the chip. Each microchannel layer had 20 channels with an aspect ratio of 4:1. Direction of the second microchannel layer was rotated 90 deg with respect to the first layer. Fully three-dimensional (3D) conjugate heat transfer analysis was performed to study the heat removal capacity of the proposed two-layer microchannel cooling design for high heat flux chips. In the next step, a linear stress analysis was performed to investigate the effects of thermal stresses applied to the microchannel cooling design due to variations of temperature field. Results showed that two-layer microchannel configuration was capable of removing heat from high heat flux chips with a hot spot.

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Section: Introductionmentioning

confidence: 99%

Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

Abdoli

Dulikravich

Vasquez

et al. 2015

Journal of Electronic Packaging

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show abstract

“…Abdoli and Dulikravich [106,107] demonstrated that Gaussian Radial Basis Function (GRBF) method gives more accurate results in comparison to other response surface methods. Then, this GRBF was coupled to NSGA-II multi-objective optimization algorithm in modeFRONTIER software in order to perform the optimization.…”

Section: Optimization Methodologymentioning

confidence: 99%

Optimization of Cooling Protocols for Hearts Destined for Transplantation

Abdoli¹

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“…This conflict of design objectives can be overcome by performing a multi-objective optimization. Abdoli and Dulikravich performed multi-objective optimization of multi-floor counterflow [5] and throughflow [6] In recent years, micro-jet cooling has been getting more attention in the thermal management community. This involves directly spraying the hot surface with an array of liquid micro-jets to reduce temperatures in the region.…”

mentioning

confidence: 99%

Multi-Objective Analysis and Optimization of Integrated Cooling in Micro-Electronics With Hot Spots

Reddy¹

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Optimized multi-floor throughflow micro heat exchangers

Cited by 8 publications

References 18 publications

Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

Thermo-Fluid-Stress-Deformation Analysis of Two-Layer Microchannels for Cooling Chips With Hot Spots

Optimization of Cooling Protocols for Hearts Destined for Transplantation

Multi-Objective Analysis and Optimization of Integrated Cooling in Micro-Electronics With Hot Spots

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