2005
DOI: 10.1063/1.1935745
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Optimized cleaning method for producing device quality InP(100) surfaces

Abstract: A very effective, two-step chemical etching method to produce clean InP(100) surfaces when combined with thermal annealing has been developed. The hydrogen peroxide/sulfuric acid based solutions, which are successfully used to clean GaAs(100) surfaces, leave a significant amount of residual oxide on the InP surface which can not be removed by thermal annealing. Therefore, a second chemical etching step is needed to remove the oxide. We found that strong acid solutions with HCl or H 2 SO 4 are able to remove th… Show more

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Cited by 58 publications
(49 citation statements)
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References 20 publications
(28 reference statements)
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“…1-3 Among them, chemical cleaning is the simplest and easiest to control and has been widely applied to GaAs, 2-13 InP, 3,11,[14][15][16] and GaP. 17,18 The chemicals used in these studies are mainly acidic ͑HCl, HF, H 2 SO 4 /H 2 O 2 , etc.͒ and alkaline ͑KOH, NH 4 OH, etc.͒ solutions.…”
Section: Introductionmentioning
confidence: 99%
“…1-3 Among them, chemical cleaning is the simplest and easiest to control and has been widely applied to GaAs, 2-13 InP, 3,11,[14][15][16] and GaP. 17,18 The chemicals used in these studies are mainly acidic ͑HCl, HF, H 2 SO 4 /H 2 O 2 , etc.͒ and alkaline ͑KOH, NH 4 OH, etc.͒ solutions.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3] Among them, chemical cleaning is the simplest and easiest to control and has been widely applied to GaAs, 2,4-11 InP, 3,10,[12][13][14] GaSb, 15 InAs, 16 InSb, 17 GaN, [18][19][20] and AlN. 19,20 The chemicals used in these studies are mainly acidic solutions ͑HCl, HF, H 2 SO 4 /H 2 O 2 , etc.͒.…”
Section: Introductionmentioning
confidence: 99%
“…This indicates that most of the oxidation occurs on the In, while most In-P back bonds are intact. This is because the clean InP starting surface prepared in our study is In terminated [18] and the oxidation occurs at room temperature; there is not enough energy to break the In-P back bonds and cause the further oxidation of phosphorous in InP substrate.…”
Section: Decay Of Quantum Yield Change Of Cs Oxide and Substrate Oximentioning
confidence: 99%
“…Chemical cleaning process described in our earlier work [18] The photoemission spectra are collected at normal emission angle with a PHI (model 10-360) spherical energy analyzer with a multi-channel detector. The spectra are fitted with Voigt functions, which are Gaussian broadened Lorentzian line shapes.…”
mentioning
confidence: 99%