Optimization Study on Urban Logistics Network

Li, Yanfeng; Zhao, Yu Ming; Xue, Ning

doi:10.1061/40996(330)485

Logistics 2009

DOI: 10.1061/40996(330)485

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Optimization Study on Urban Logistics Network

Yanfeng Li¹,

Yu Ming Zhao²,

Ning Xue³

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2014

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“…In addition, the decarboxylation and dehydration reactions during heating reduced the active continuity of dibasic acid and polybasic acid, so "de-wetting phenomenon" and the irregular shape will appear in edge of solder spot [14]. During soldering , assuming the liquid solder has been entirely spread to equilibrium.…”

mentioning

confidence: 99%

Effects of Organic Acids on Wettability of Sn-0.3Ag0.7Cu Lead-Free Solder

Tang

Gan

Luo

et al. 2014

AMM

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In the assembly of electronic products, developing good organic acid fluxes plays an important role in improving the solderability of lead-free solders. In this paper, a variety of fluxes containing 5% (mass fraction) organic acid activators were prepared. Effects of different activators on the spreading rates of Sn-0.3Ag0.7Cu solder were studied. The results show that: activity of monobasic acids are weak except for benzoic acid; dibasic acids and polybasic acids have relatively strong activity but serious corrosion and slightly less activity persistence. Compounding palmitic acid and adipic acid in the mass ratio of 1:2 as the activator, the average spreading rate of Sn-0.3Ag0.7Cu solder is 71.11% in maximum. Compounding succinic acid and adipic acid in the mass ratio of 3:7 as the activator, the average spreading rate is up to 72.49% in maximum. And solder spots are in-erratic, bright and plump, meeting the quality requirements of electronic micro-connection.

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mentioning

confidence: 99%

Effects of Organic Acids on Wettability of Sn-0.3Ag0.7Cu Lead-Free Solder

Tang

Gan

Luo

et al. 2014

AMM

View full text Add to dashboard Cite

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Optimization Study on Urban Logistics Network

Cited by 1 publication

References 1 publication

Effects of Organic Acids on Wettability of Sn-0.3Ag0.7Cu Lead-Free Solder

Effects of Organic Acids on Wettability of Sn-0.3Ag0.7Cu Lead-Free Solder

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