Optimization of the Micro Channel Heat Sink by Combing Genetic Algorithm with the Finite Element Method

Lin, David T.W.; Kang, Chung-Hao; Chen, Sheng-Chung

doi:10.3390/inventions3020032

Cited by 10 publications

(4 citation statements)

References 17 publications

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“…After analyzing the correlation coefficient and signalto-noise ratio, their results showed that the Taguchi experiment model may have some limitations in detecting the edge of process space. Lin et al [105] combined the FEM and GA to design a micro multichannel heat sink with minimum thermal resistance, the control parameters such as channel number and channel size were considered as optimisation variables. Their results showed that the thermal resistance was effectively reduced by 0.144 W/K.…”

Section: Taguchi Methods (Tm) and Genetic Algorithms (Ga)mentioning

confidence: 99%

Fluid flow and heat transfer in microchannel heat sinks: Modelling review and recent progress

Gao

Yang

et al. 2022

Thermal Science and Engineering Progress

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Section: Taguchi Methods (Tm) and Genetic Algorithms (Ga)mentioning

confidence: 99%

Fluid flow and heat transfer in microchannel heat sinks: Modelling review and recent progress

Gao

Yang

et al. 2022

Thermal Science and Engineering Progress

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“…The optimized shape is then extended along the flow direction to form the entire channel length without further modifications of the channel passage (to be introduced in Section 3.2.2). Based on the design parametrizations, the studies in this category could be classified into three classes, as shown in Figure 8: (a) optimization of single channel cross-section size/parameter based on a predefined simple geometry [55][56][57][58][59][60][61][62][63][64][65]; (b) optimization of single channel cross-section shape [66,67]; and (c) TO of the entire cross-section of the heat sink [68]. The key step in the optimization is establishing the relationship between the design variables and the objective function, either by direct physics analysis or by constructing a surrogate function.…”

Section: Channel Cross-section Optimizationmentioning

confidence: 99%

Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review

Li,

Roux,

Castelain

et al. 2023

Energies

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This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems. Special focus is given to the design and structural optimization of heat sinks for efficient single-phase liquid cooling. Firstly, the paper highlights the common presence and detrimental consequences of electronics overheating resulting from multiple heat sources, supported by various illustrative examples. Subsequently, the emphasis is placed on single-phase liquid cooling as one of the effective thermal management technologies for power electronics, as well as on the enhancement of heat transfer in micro/mini channel heat sinks. Various studies on the design and structural optimization of heat sinks are then analyzed and categorized into five main areas: (1) optimization of channel cross-section shape, (2) optimization of channel flow passage, (3) flow distribution optimization for parallel straight channel heat sinks, (4) optimization of pin-fin shape and arrangement, and (5) topology optimization of global flow configuration. After presenting a broad and complete overview of the state of the art, the paper concludes with a critical analysis of the methods and results from the literature and highlights the research perspectives and challenges in the field. It is shown that the issue of uneven and overheating caused by multiple heat sources, which is commonly observed in modern electronics, has received less attention in the literature compared to uniform or single-peak heating. While several design and structural optimization techniques have been implemented to enhance the cooling performance of heat sinks, topology optimization has experienced significant advancements in recent years and appears to be the most promising technology due to its highest degree of freedom to treat the uneven heating problem. This paper can serve as an essential reference contributing to the development of liquid-cooling heat sinks for efficient thermal management of electronics.

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“…[27,28]. Several algorithms are suggested towards microchannel fins optimization; however, combination of genetic algorithm with the finite element methods is one of the interesting methods adopted for the thermal optimization of microchannel fins [29]. Another effective approach for the optimization study is the multi-objective optimization via using the weighted sum method with the genetic algorithm [30].…”

Section: Introductionmentioning

confidence: 99%

Influence of Hydrophobic Fin Configuration in Thermal System in Relation to Electronic Device Cooling Applications

2020

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In this study, heat and flow analysis of the cooling system incorporating fins with hydrophilic and hydrophobic wetting surfaces has been considered in relation to electronic cooling applications. Temperature and velocity fields in the solution domain are simulated for various fin numbers and sizes. A temperature parameter is introduced to assess the thermal performance of the system. Fin count is introduced to formulate the number of fins in the solution domain. The Nusselt number and pressure drop between the inlet and exit ports due to different fin configurations of the cooling system for various fin counts are presented. It is found that the temperature parameter attains high values for large sizes and small fin counts, which is more pronounced for low Reynolds numbers. Increasing number of fins results in almost uniform flow distribution among the fin, which is more pronounced for the hydrophobic fin configuration. The Nusselt number attains larger values for the hydrophilic fin configuration than that corresponding to the hydrophobic fin, and it attains a peak value for certain arrangement of fin count, which differs with the Reynolds number. The pressure drop between the inlet and exit ports reduces for hydrophobic fin; hence the slip velocity introduced for hydrophobic fin improves the pressure drop by 6% to 16% depending on the fin counts in the cooling system.

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Optimization of the Micro Channel Heat Sink by Combing Genetic Algorithm with the Finite Element Method

Cited by 10 publications

References 17 publications

Fluid flow and heat transfer in microchannel heat sinks: Modelling review and recent progress

Fluid flow and heat transfer in microchannel heat sinks: Modelling review and recent progress

Design and Optimization of Heat Sinks for the Liquid Cooling of Electronics with Multiple Heat Sources: A Literature Review

Influence of Hydrophobic Fin Configuration in Thermal System in Relation to Electronic Device Cooling Applications

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