Optimization of the geometry of the reactor inductance coil for reactive-ion etching by modeling in the COMSOL Multiphysics software package

Endiiarova, Ekaterina V.; Eritsyan, G.S.

doi:10.1016/j.matpr.2020.01.033

Cited by 4 publications

(6 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…To give an insight into the variation of plasma parameters due to ground metal surface, plasma behavior is simulated by a finite-element method using a multi-physics simulation software COMSOL with ICP interface. 30) The details of the simulation are moved to the appendix in order to provide better understanding. Figure 2 shows a schematic diagram of a simulated ICP chamber with an RF bias stage.…”

Section: Experimental Methodsmentioning

confidence: 99%

Influence of small ground surface on plasma property in an inductively-coupled plasma with floating liner

Kyuzo

Chiba

Suzuki

et al. 2022

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

Currently, components of semiconductor processing chamber are coated with oxides to avoid metal contamination. As a result, electrical ground is hidden from the plasma. In this study, we experimentally investigate the effect of small ground surfaces in an inductively-coupled plasma (ICP) generated in an electrically floating liner. Peak-to-peak and DC voltages at a bias stage and a floating liner are measured as a function of stage peak-to-peak voltage for various ICP powers and the ground surface areas. The results show that the stage and liner voltages vary with changing the ground surface area due to change in sheath thickness. Analytical plasma potentials calculated from the experimental values are compared with the simulation results, which shows good agreement. It is suggested that under low bias voltage and high ICP power conditions, such as in the atomic layer etching process, the small ground surface affects the potential structure in the chamber.

show abstract

Section: Experimental Methodsmentioning

confidence: 99%

Influence of small ground surface on plasma property in an inductively-coupled plasma with floating liner

Kyuzo

Chiba

Suzuki

et al. 2022

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

show abstract

“…Meantime, the procedure of plasma simulation is a robust platform for designing and studying the tools applying plasma. COMSOL Multiphysics is one of the powerful tools for plasma simulation, and by combining the models in this software, conditions similar to real plasma modes can be provided [13][14][15][16][17][18].…”

Section: Methodsmentioning

confidence: 99%

The simulation of plasma in magnetic conical-cusp mirrors using COMSOL multiphysics

Ghanbari¹

2021

Phys. Scr.

View full text Add to dashboard Cite

In nuclear fusion plasma, open magnetic systems have advantages, including high beta, no neoclassical radial transport, ease preservation, and upgrades. Magnetic Conical-Cusp Mirror is one of these systems that has attracted the attention of researchers. In the Conical-Cusp Mirror device, plasma is confined by various magnetic coils with different current directions. In this work, a Conical-Cusp Mirror plasma system and a simple magnetic mirror plasma were simulated by COMSOL Multiphysics. Moreover, magnetic field gradient and plasma beta were compared in these two systems. The results showed that the Conical-Cusp Mirror plasma is more stable and has higher beta.

show abstract

“…In this paper, we use a two-dimensional fluid model to describe particle transport in CCP discharges and obtain the density, momentum, and energy of each species by solving Poisson’s equation and the first two moments of the Boltzmann equation. The electron density and average electron energy are calculated by solving their drift-diffusion equations [ 20 , 26 ]:

where

represents the electron density,

the electron mobility,

the RF electric field,

electron diffusivity,

the mole fraction of the target species for reaction

the rate coefficient for reaction

the total neutral number density,

the electron energy density,

the electron energy mobility, and

the electron temperature.

and

are the electron energy diffusivity and the source term for electron energy, respectively.…”

Section: The Numerical Simulation Of Ccp With Additional Electrodesmentioning

confidence: 99%

“…E.V. Endiarova et al improved the distribution characteristics of plasma by optimizing the geometry of the reactive ion coil [ 20 ]. Ho Jun Kim proved that the dielectric sidewall can lead to a more uniform plasma distribution than the grounded sidewall through simulation and experiment [ 21 ].…”

Section: Introductionmentioning

confidence: 99%

The Tailored Material Removal Distribution on Polyimide Membrane Can Be Obtained by Introducing Additional Electrodes

et al. 2023

View full text Add to dashboard Cite

Reactive ion etching (RIE) is a promising material removal method for processing membrane diffractive optical elements and fabrication of meter-scale aperture optical substrates because of its high-efficiency parallel processing and low surface damage. However, the non-uniformity of the etching rate in the existing RIE technology will obviously reduce the machining accuracy of diffractive elements, deteriorate the diffraction efficiency and weaken the surface convergence rate of optical substrates. In the etching process of the polyimide (PI) membrane, additional electrodes were introduced for the first time to achieve the modulation of the plasma sheath properties on the same spatial surface, thus changing the etch rate distribution. Using the additional electrode, a periodic profile structure similar to the additional electrode was successfully processed on the surface of a 200-mm diameter PI membrane substrate by a single etching iteration. By combining etching experiments with plasma discharge simulations, it is demonstrated that additional electrodes can affect the material removal distribution, and the reasons for this are analyzed and discussed. This work demonstrates the feasibility of etching rate distribution modulation based on additional electrodes, and lays a foundation for realizing tailored material removal distribution and improving etching uniformity in the future.

show abstract

Optimization of the geometry of the reactor inductance coil for reactive-ion etching by modeling in the COMSOL Multiphysics software package

Cited by 4 publications

References 13 publications

Influence of small ground surface on plasma property in an inductively-coupled plasma with floating liner

Influence of small ground surface on plasma property in an inductively-coupled plasma with floating liner

The simulation of plasma in magnetic conical-cusp mirrors using COMSOL multiphysics

The Tailored Material Removal Distribution on Polyimide Membrane Can Be Obtained by Introducing Additional Electrodes

Contact Info

Product

Resources

About