Optimization of the current density distribution in electrochemical cells based on the level set method and genetic algorithm

Abstract

Abstract. This paper proposes a general applicable algorithm for the optimization of the current density distribution in the electrochemical cells using the insulating shields during the electroplating process. The innovative aspect is that the position of the insulating shield is displaced over a number of predefined time steps convecting its surface proportional with and in the direction of a well chosen rate provided by a genetic algorithm. The aim of this method is to develop a systematic modification of the insulating shield position in order to get a more uniform distribution of the current density, hence a more uniform deposited layer at the cathode. As the displacement of the insulating shield is performed with the Level Set Method, the re-meshing of the computational domain with finite elements is not required anymore. Finally an example related to the optimization of the current density distribution in the vicinity of a singularity (incident angle between the electrode and insulator = 180 o ), using an insulating shield will be presented.

Development of novel electroplating tank layout by computer simulations and verification tests

“…During the last two decades, significant work on developing methods for modelling electrochemical cells has been done in the University of Brussels 10-13 and these methods have been applied to simulating various industrial processes. [14][15][16][17][18] Practical simulation studies of laboratory and industrial scale plating processes have also been made by other research groups [19][20][21][22][23] and some studies of developing the layout of the plating tank 16,[24][25][26] can be found. However, to the authors' knowledge, the elementary configuration of the plating tank has not been developed as extensively as in this study.…”