2021 IEEE International Memory Workshop (IMW) 2021
DOI: 10.1109/imw51353.2021.9439618
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Optimization of Switching Metrics for CMOS Integrated HfO2 based RRAM Devices on 300 mm Wafer Platform

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Cited by 14 publications
(6 citation statements)
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“…28,29,36 However, inorganic materials require high-vacuum techniques to produce such notable features. The most common methods are atomic layer deposition (ALD), 37 RF sputtering, 38 thermal evaporation, pulsed laser deposition (PLD), and e-beam evaporation. 39,40 In addition, these techniques are only applicable when a compressed target is available, so these are not suitable for solution-based materials, particularly organics and nanoparticles.…”
Section: Introductionmentioning
confidence: 99%
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“…28,29,36 However, inorganic materials require high-vacuum techniques to produce such notable features. The most common methods are atomic layer deposition (ALD), 37 RF sputtering, 38 thermal evaporation, pulsed laser deposition (PLD), and e-beam evaporation. 39,40 In addition, these techniques are only applicable when a compressed target is available, so these are not suitable for solution-based materials, particularly organics and nanoparticles.…”
Section: Introductionmentioning
confidence: 99%
“…; , and (3) organic materials such as PEDOT:PSS, PVK, PANI, and carbon-based materials such as graphene oxide (GO) and reduced graphene oxide (rGO). , Until now, inorganic materials, particularly binary oxides, have shown significant characteristics in terms of stability, reproducibility, and CMOS process flow compatibility. ,, However, inorganic materials require high-vacuum techniques to produce such notable features. The most common methods are atomic layer deposition (ALD), RF sputtering, thermal evaporation, pulsed laser deposition (PLD), and e-beam evaporation. , In addition, these techniques are only applicable when a compressed target is available, so these are not suitable for solution-based materials, particularly organics and nanoparticles. Thus, several solution-based techniques are developed to take advantage of organic materials .…”
Section: Introductionmentioning
confidence: 99%
“…They are usually based on the valance change mechanism (VCM) [38] or electrochemical metallization (ECM) effect [39]. These devices have been successfully scaled down to sub 10 nm dimensions [40], offer high switching speeds down to some nanoseconds and below [41], [42], and have been fabricated using established and industry-relevant CMOS-or back-end-of-line processes (BEOL) [43]- [46]. Very recently, Li et al suggested a novel memristive FPAA for analog computing [47], which was experimentally implemented with 2 µm feature size technology.…”
Section: Introductionmentioning
confidence: 99%
“…[3][4][5] However, for industrial production, researchers have been focusing more on the improvement of RRAM device structure and performance optimization, but the studies on device storage reliability and decay mechanisms are still insufficient. [6][7][8][9] Temperature is an essential thermodynamic parameter in many aerospace and industrial manufacturing areas. Understanding the effects of temperature on memory devices allows the trade-off between performance and reliability to be better controlled when designing devices, which is essential for preparing memory devices with good performance and high reliability.…”
Section: Introductionmentioning
confidence: 99%
“…[ 3–5 ] However, for industrial production, researchers have been focusing more on the improvement of RRAM device structure and performance optimization, but the studies on device storage reliability and decay mechanisms are still insufficient. [ 6–9 ]…”
Section: Introductionmentioning
confidence: 99%