Optimization of solder reflow processing and part design in thermoplastic optical interconnect components

Johnson, Peter M.; Sugawara, Takamune; Ohno, Norihiko; Hoogland, Gabrie

doi:10.1117/12.2543215

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Property Comparison 11 Materials Choices1

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2022

2024

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Cited by 2 publications

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“…A common printed circuit board, PCB, composite material was included for comparison purposes. Table 1 includes various thermoplastics, glass, silicon, and FR4 composite [5]. Transparent epoxy properties were excluded due to the wide range of possible commercial formulations.…”

Section: Property Comparison 11 Materials Choicesmentioning

confidence: 99%

Performance evaluation of a new thermoplastic polymer against glass and thermoset resins for optical transceivers

Johnson,

Hoogland,

Choi

2024

Optical Interconnects XXIV

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Optical components which transmit light can be made through various processes and materials, such as glass, thermosets, or thermoplastics. These components are then assembled with fiber optic cables and light sources to complete the full optical assembly. This potential mixture of different types of materials can impact dimensional position of various alignment features needed for low signal loss. In this paper, we show the beneficial or detrimental effects of mixed materials and component design on dimensional alignment in optical assemblies. For assembly, solder reflow capable thermoplastic resins are evaluated and compared to other commercially available material classes in ease of assembly, design, and performance parameters.

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Section: Property Comparison 11 Materials Choicesmentioning

confidence: 99%