2017
DOI: 10.1515/meceng-2017-0020
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Optimization of Process Parameters During End Milling and Prediction of Work Piece Temperature Rise

Abstract: During the machining processes, heat gets generated as a result of plastic deformation of metal and friction along the tool-chip and tool-work piece interface. In materials having high thermal conductivity, like aluminium alloys, large amount of this heat is absorbed by the work piece. This results in the rise in the temperature of the work piece, which may lead to dimensional inaccuracies, surface damage and deformation. So, it is needed to control rise in the temperature of the work piece. This paper focuses… Show more

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Cited by 29 publications
(26 citation statements)
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References 34 publications
(56 reference statements)
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“…Nonproductive time has also been minimized by synchronizing rapid movements of cutting tool using hybrid GA during 2.5 D milling [56]. Yang et al [60] adopted GA-PSO technique to maximize the profit rate. GA-PSO found better than other GA developed earlier.…”
Section: Response Surface Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…Nonproductive time has also been minimized by synchronizing rapid movements of cutting tool using hybrid GA during 2.5 D milling [56]. Yang et al [60] adopted GA-PSO technique to maximize the profit rate. GA-PSO found better than other GA developed earlier.…”
Section: Response Surface Methodsmentioning
confidence: 99%
“…Gupta et al [56] Optimized machining parameters for minimizing unit cost using GA. Yang et al [60] Concluded that GA-PSO is better than other GA.…”
Section: Gupta Et Al [55]mentioning
confidence: 99%
“…Bhirudand R.R. Gawande [11] determined the impact of heat generated during the machining of materials of high conductivity. Performed end milling on Al 6063 in absence of coolant.…”
Section: Literature Reviewmentioning
confidence: 99%
“…The literature includes studies aiming to simulate [ 15 , 16 ] and optimize [ 17 ] the cutting process so that the excess heat generated at the tool−workpiece interface was reduced. Some research, e.g., [ 16 ], was based on finite difference analysis (FDA) to predict changes in the temperature and thermal resistance at the tool−chip interface.…”
Section: Introductionmentioning
confidence: 99%