2015
DOI: 10.1088/1054-660x/25/5/056003
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Optimization of plasma effect in laser drilling of high aspect ratio microvias

Abstract: The simple theoretical model of heating side walls by laser plasma in the laser drilling of high aspect ratio microvias in metals and semiconductors is proposed. According to this model the recommendations are given on how to avoid the undesirable effect of melting side walls by laser plasma, strongly deteriorating microdrilling quality. The obtained results constitute a physical basis for the development of clean laser microdrilling. Particular estimations are given for the laser drilling of silicon wafers.

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Cited by 9 publications
(4 citation statements)
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“…As can be easily shown, for the assumed Gaussian distribution of w the r1/2 radius relates with the previously introduced rf = r1/e as r1/2 = (ln2) 1/2 rf ≅ 0.83rf. The model follows up a concept of an indirect action of laser radiation on the material [40,41] that has been successfully applied to the deep (high-aspect-ratio) drilling of opaque materials. That is, the incident laser energy is at first transformed into the plasma energy (in the given case, the filament plasma) with a conversion coefficient (absorptivity) AL-P.…”
Section: = (mentioning
confidence: 99%
“…As can be easily shown, for the assumed Gaussian distribution of w the r1/2 radius relates with the previously introduced rf = r1/e as r1/2 = (ln2) 1/2 rf ≅ 0.83rf. The model follows up a concept of an indirect action of laser radiation on the material [40,41] that has been successfully applied to the deep (high-aspect-ratio) drilling of opaque materials. That is, the incident laser energy is at first transformed into the plasma energy (in the given case, the filament plasma) with a conversion coefficient (absorptivity) AL-P.…”
Section: = (mentioning
confidence: 99%
“…• Optimization of plasma effect in laser drilling of high aspect ratio microvias-a simple theoretical model of heating side walls by a laser plasma, in the laser drilling of high aspect ratio microvias in metals and semiconductors, is proposed [58].…”
Section: Interaction Of Laser Radiation With Mattermentioning
confidence: 99%
“…• Optimization of plasma effect in laser drilling of high aspect ratio microvias-a simple theoretical model of heating side walls by a laser plasma, in the laser drilling of high aspect ratio microvias in metals and semiconductors, is proposed [58]. • A trace gas sensor using near infrared distributed feedback laser at 1654 nm-a costeffective compact instrument for high-stable and sensitive detection of methane based on the tunable diode laser absorption spectroscopy technique is experimentally demonstrated [59].…”
Section: Interaction Of Laser Radiation With Mattermentioning
confidence: 99%