Optimization of packaging materials and design for thermal management in stacked-die packages

Abstract

Various package level thermal management schemes are discussed. Extensive sensitivity study data of thermally conductive packaging materials such as die adhesive, mold compound, and board level underfill are reviewed on different package architectures by using JEDEC standards. Thermal benefits of heat spreader embedded stacked-die packages are also investigated. By using the validated detailed package thermal model, the design cycle and time-to-market can be significantly reduced.