Optimization of Ni/Ag-Based Reflectors to Improve the Performance of 273 nm Deep Ultraviolet AlGaN-Based Light Emitting Diodes

Abstract

We optimized Ni/Ag-based p-type reflectors for the improvement of efficiency of 273 nm deep ultraviolet (DUV) AlGaN-based flip-chip light emitting diodes (FCLEDs). The Ni(3 nm)/Ag(5–15 nm)/Al/Ni and Ni(25–50 nm)/Ag/Ni contacts exhibited higher reflectance (36.4–39.5%) at 273 nm than reference Ni(5 nm)/Au(5 nm)/Al/Ni contact (26.1%). The Ni(3 nm)/Ag/Al(200 nm)/Ni(20 nm) and Ni/Ag(200 nm)/Ni(20 nm)-based FCLEDs gave forward voltages in the rage of 6.93–7.11 V and 5.5–6.28 V at 20 mA, respectively, whereas the Ni/Au-based sample showed 6.35 V. Further, the Ni(3 nm)/Ag(10 nm)/Al/Ni-based and Ni(50 nm)/Ag(200 nm)/Ni-based samples exhibited 4.85% and 13.4% larger output power at 1.2 W than the reference sample. The Ni(3 nm)/Ag(10 nm)-based and Ni(50 nm)/Ag(200 nm)/Ni-based samples produced 5.6% and 8.5% higher peak external quantum efficiency than the reference sample. It was further shown that the Ni(3 nm)/Ag(10 nm)/Al/Ni-based and Ni(50 nm)/Ag(200 nm)/Ni-based samples experienced less efficiency droop (namely, 27.9 and 26.4%, respectively) than the reference sample (31.4%). Based on the scanning transmission electron microscopy and X-ray photoemission spectroscopy results, the ohmic formation mechanism is described and discussed.

Electrical Characteristics of Thermally Stable Ag–Pd–Cu Alloy Schottky Contacts on n-Al0.6Ga0.4N

“…24,60,61 In other words, Ag exhibited poor adhesion with GaN and AlGaN. Thus, in a few works, 23,62 a thin interlayer (<5 nm thick) was adopted as an adhesion layer. Furthermore, after annealing at 300 °C, the micro-voids were eliminated owing to the migration of Ag atoms for stress relaxation.…”