Optimization of MOSFET Copper Clip to Enhance Thermal Management Using Kriging Surrogate Model and Genetic Algorithm
Yubin Cheon,
Jaehyun Jung,
Daeyeon Ki
et al.
Abstract:Metal–oxide–semiconductor field-effect transistors (MOSFETs) are critical in power electronic modules due to their high-power density and rapid switching capabilities. Therefore, effective thermal management is crucial for ensuring reliability and superior performance. This study used finite element analysis (FEA) to evaluate the electro-thermal behavior of MOSFETs with copper clip bonding, showing a significant improvement over aluminum wire bonding. The aluminum wire model reached a maximum temperature of 10… Show more
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