Optimization of mechanical properties of Sn-3.8Ag-0.7Cu alloys by the additions of Bi, In and Ti

Chen, Youyang; You, Kangdong; Yu, Shuting; Yang, Tixin; Dong, Ziqiang; Zhang, Jincang; Jia, Yandong; Wang, Gang; Peng, Jubo; Cai, Shanshan; X, Luo; Wang, Jiajun; Liu, Chen

doi:10.1016/j.pnsc.2022.10.004

Cited by 5 publications

(5 citation statements)

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“…Thus, improves the ductility of SAC-3Bi-0.2Te alloy. Table 2 also revealed that the YS and UTS of low-Ag SAC155 alloys are comparable to several recent works on high-Ag solder alloys [19,23], although the ductility of SAC-3Bi-0.2Te alloy is higher than most of them.…”

Section: Microalloying Effects On Mechanical Propertiessupporting

confidence: 84%

“…% at 25 °C) [11,23]. Hence, the fine intra-granular Bi particles and cubic-shaped Bi particle/ dislocation pinning will enormously enhance the tensile strength [19,23]. The Te addition leads to the formation of compositional heterogeneity.…”

Section: Microstructure Of Alloy Samplesmentioning

confidence: 99%

“…On the other hand, the obstructing force and misfit strain, which have a strong correlation with the atomic radii (table 6) of Bi, In, and Te with the β-Sn matrix atoms, determine the hindering effect [19]:…”

Section: Alloying Effects On the Deformation Mechanismmentioning

confidence: 99%

“…Besides, the F m is proportional to ε. Table 6 presents the atomic radii of microalloying elements [19]. Remarkably, the tiny lattice mismatch between Sn and In due to their different atomic radii makes the solid-solution strengthening contributions from Bi is less operative, as it increases the Bi precipitations (see figure 2(b)).…”

Section: Alloying Effects On the Deformation Mechanismmentioning

confidence: 99%

“…While some studies examined the effects of microalloying elements like Bi, In, Ti, Te, and Ni on the mechanical characteristics of SAC solders, most of them have only focused to SAC alloys with high silver content, like Sn-3.8Ag-0.7Cu-3.5Bi-1.5Sb-0.15Ni [18] and Sn-3.8Ag-0.7Cu-3.5Bi-2.8In-0.8Ti [19]. Unfortunately, as Ag content increases, coarse Ag 3 Sn IMCs increase, which may weaken the alloy solders and reduce their mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

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Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te

Eid,

El-Daly,

Ibrahiem

2024

Phys. Scr.

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The mechanical characteristics of Sn-1.5Ag-0.5Cu (SAC155) alloy modified with In, Bi, and Te microalloying are investigated in relation to three strengthening mechanisms that withstand coarsening: i) micron-scale Ag3Sn, Cu6Sn5, SnTe, Ag2In and InSn4 IMC precipitated phases, ii) Bi in solid solution and iii) Bi precipitated particles formed upon eutectic solidification. Compared to SAC155 alloy with a single strengthening mechanism, the combined effect of threedeformation processes operating in SAC(155)-3Bi-2In with high In content and SAC(155)-3Bi-0.2Te (wt%) with low Te content alloys greatly improved the mechanical properties at high temperatures. It was found that, despite a discernible reduction in ductility, the high In content could refine the microstructure,enrich the elastic modulus (E), yield stress (YS), and ultimate tensile strength (UTS) of SAC(155)-3Bi-2In to almost 2.3 times that of SAC155 solder. On the other hand, a low Te content greatly increased SAC(155)-3Bi-0.2Te's mechanical strength ⁓2.3 times, while a large atomic size difference between Te and Sn atoms caused excessive misfit strain, which in turn increased Bi's solubility in β-Sn grains, and improved ductility by approximately twice that of SAC(155)-3Bi-2In solder.

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Section: Microalloying Effects On Mechanical Propertiessupporting

confidence: 84%