Optimization of Layer Transfer and Photolithography for Device Integration of 2D-TMDC

Abstract

Extensive research into two-dimensional transition metal dichalcogenides (2D-TMDCs) over the past decade has paved the way for the development of (opto)electronic devices with enhanced performance and novel capabilities. To realize devices based on 2D-TMDC layers, compatible and optimized technologies such as layer transfer and photolithography are required. Challenges arise due to the ultrathin, surface-only nature of 2D layers with weak van der Waals adhesion to their substrate. This might potentially compromise their integrity during transfer and photolithography processes, in which prolonged exposure at usually high temperature to reactive chemicals and strong solvents are conventionally used. In this paper, we show that employing a dry-transfer technique based on thermal release tape (TRT) as an alternative to wet processes based on KOH solution better preserves layer quality. In the succeeding device fabrication process, an optimized photolithography as a cost-effective and widely available method for device patterning is utilized. The introduced photolithography protocol presents a near-perfect yield and reproducibility. To validate our optimized techniques, we fabricated field-effect transistors (FETs) using 2D-MoS2 layers from metal–organic chemical vapor deposition (MOCVD), wet- and dry-transferred onto SiO2/Si substrates. Our findings mark a significant stride towards the efficient and industry-compatible utilization of 2D van der Waals materials in device fabrication.