Optimization of lapping processes of silicon wafer for photovoltaic applications

Öztürk, Savaş; Aydın, Levent; Küçükdoğan, Nilay; Çelik, Erdal

doi:10.1016/j.solener.2018.02.039

Cited by 30 publications

(7 citation statements)

References 32 publications

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“…Consequently, the photovoltaic industry consumes approximately 90% of the crystalline silicon produced globally. Crystalline silicon is favored over other semiconductor materials due to its abundance in the earth's crust, comprising approximately 27% of the minerals present (Ozturk et al, 2018a;Yu et al, 2012). The semiconductor characteristics of crystalline silicon allows a high efficiency to be obtained in power generation.…”

Section: Introductionmentioning

confidence: 99%

Effect of cutting parameters on surface integrity of monocrystalline silicon sawn with an endless diamond wire saw

et al. 2020

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The cutting of silicon wafers using multi-diamond wire sawing is a critical stage in solar cell manufacturing due to brittleness of silicon. Improving the cutting process output requires an in-depth understanding of phenomena associated with cutting parameters. In order to investigate the influence of diamond wire sawing on surface integrity of monocrystalline silicon, a looped diamond wire was used and cutting parameters wire cutting speed, feed rate and wire tension were varied. The surface morphology was observed by scanning electron microscopy. Surface roughness S a was measured with a non-contact profilometer. The brittle-ductile transition was identified by presence of residual phases on sawn surface. A bevel-polishing method was employed to determine the microcrack depth. The results show that with higher feed rate the surface presents deeper and wider craters because of deeper penetration of diamond grain. On increasing wire cutting speed, there were more regions formed in ductile mode. The higher S a values was observed on increasing both feed rate and wire tension, while S a decreased with an increase in wire cutting speed. The brittle mode was predominant with an increase in feed rate, resulting in Si-I phase in regions formed in fragile mode. Material removal in ductile mode led to appearance of a-Si phase at high wire cutting speed. No significant effect was observed on increasing wire tension. Subsurface microcracks mainly initiating from bottom of grooves generated by cutting mechanism. The most appropriate set of cutting parameters is the lowest feed rate and wire tension and highest wire cutting speed.

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Section: Introductionmentioning

confidence: 99%

Effect of cutting parameters on surface integrity of monocrystalline silicon sawn with an endless diamond wire saw

et al. 2020

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“…It is possible to solve mixed-integer, discrete, or continuous optimization problems by using SA. The main advantage related to SA is to be a talented algorithm for these problems [20].…”

Section: Simulated Annealingmentioning

confidence: 99%

Optimum design of anti-buckling behavior of graphite/epoxy laminated composites by differential evolution and simulated annealing method

Akçair¹,

Savran²,

Aydın³

et al. 2019

Res. Eng Struct. Mat

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DisclaimerAll the opinions and statements expressed in the papers are on the responsibility of author(s) and are not to be regarded as those of the journal of Research on Engineering Structures and Materials (RESM) organization or related parties. The publishers make no warranty, explicit or implied, or make any representation with respect to the contents of any article will be complete or accurate or up to date. The accuracy of any instructions, equations, or other information should be independently verified. The publisher and related parties shall not be liable for any loss, actions, claims, proceedings, demand or costs or damages whatsoever or howsoever caused arising directly or indirectly in connection with use of the information given in the journal or related means.Published articles are freely available to users under the terms of Creative Commons Attribution -NonCommercial 4.0 International Public License, as currently displayed at here (the "CC BY -NC").

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“…İlk adımda, her iterasyonda yeni bir nokta rastgele oluşturulur. Yeni noktanın mevcut noktadan uzaklığı Boltzmann'ın olasılık dağılımına dayanır ve durma kriterleri karşılanırsa algoritma durur [29]. Dağılım, bir sistemin enerjisini "T" sıcaklığındaki termal dengede gösterir.…”

Section: Geliştirilmiş Benzetilmiş Tavlama Algoritmasıunclassified

Geliştirilmiş Benzetilmiş Tavlama Algoritması Kullanılarak Minimum Fiyat, Minimum Ağırlık ve Maksimum Doğal Frekans Açısından Hibrit Grafit-Keten/Epoksi Tabakalı Kompozitlerin Optimum Tasarımı

Aydın¹,

Savran²

2019

Deu Muhendislik Fakultesi Fen Ve Muhendislik

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Öz Otomotiv, havacılık ve denizcilik endüstrilerindeki ekolojik yaklaşım, doğal liflerin (özellikle keten) yüksek doğal frekans, düşük maliyet ve ağırlık performansları nedeniyle cam elyaflara alternatif takviye malzemeleri olarak kullanılabileceğini göstermiştir. Bu bağlamda, bu çalışma, keten lif kullanımının inter-ply hibrit kompozit yapılarda doğal frekans, maliyet ve ağırlık üzerindeki etkisini araştırmaktadır. Tabakalı kompozitlerin optimum açı dizilimlerinin tespiti Geliştirilmiş Benzetilmiş Tavlama Algoritması kullanılarak yapılmıştır. Mevcut çalışmada çok amaçlı optimizasyon yaklaşımı ile maksimum doğal frekansa sahip, hafif ve düşük maliyetli bir tasarım elde edebilmek için gerekli olan yüksek rijitliğe sahip düşük maliyetli tabakaların sayısı bulunmuştur. Bu çalışma, doğal bir fiber olan keten'e ait doğal frekans-fiyat ve doğal frekans-ağırlık optimizasyon problemlerini tabakalı kompozit plakalar açısından inceleyen literatürdeki ilk çalışma olma özelliğini taşımaktadır. Sonuçlar, simetrik-balans hibrit grafit-keten/epoksi kompozit malzemenin spesifik rijitlik oranından taviz vermeden istenen frekans, fiyat ve ağırlık optimizasyonunu sağlayarak grafit/epoksi yerine kullanılmasının uygun olduğunu göstermiştir.

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Optimization of lapping processes of silicon wafer for photovoltaic applications

Cited by 30 publications

References 32 publications

Effect of cutting parameters on surface integrity of monocrystalline silicon sawn with an endless diamond wire saw

Effect of cutting parameters on surface integrity of monocrystalline silicon sawn with an endless diamond wire saw

Optimum design of anti-buckling behavior of graphite/epoxy laminated composites by differential evolution and simulated annealing method

Geliştirilmiş Benzetilmiş Tavlama Algoritması Kullanılarak Minimum Fiyat, Minimum Ağırlık ve Maksimum Doğal Frekans Açısından Hibrit Grafit-Keten/Epoksi Tabakalı Kompozitlerin Optimum Tasarımı

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