Optimization of hot-press conditions of Zn4Sb3 for high thermoelectric performance

Ueno, K.; Yamamoto, Atsushi; Noguchi, Tamotsu; Inoue, Takahiro; Sodeoka, Satoshi; Takazawa, Hiroyuki; Lee, Chul‐Ho; Obara, H.

doi:10.1016/j.jallcom.2004.03.134

Cited by 42 publications

(27 citation statements)

References 12 publications

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“…6 It can be seen that the PF of b-Zn 4 Sb 3 increased with increasing temperature. The PF obtained here for b-Zn 4 Sb 3 at 680 K is around 1.06 W m À1 K À2 , which is in good agreement with that reported by Ueno et al [13]. The PF for the lightly Te-doped compound Zn 4 (Sb 0.995 Te 0.005 ) 3 showed weak temperature dependence.…”

Section: Resultssupporting

confidence: 92%

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Effects of Te doping on the transport and thermoelectric properties of Zn4Sb3

Qin

2011

Intermetallics

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Section: Resultssupporting

confidence: 92%

“…4)(a). These values are comparable to that reported by Ueno et al [13]. The temperature behavior of thermopower S for the lightly Te-doped compound with x ¼ 0.005 is also similar to that of its electrical resistivity at the corresponding temperature range.…”

Section: Resultssupporting

confidence: 90%

Effects of Te doping on the transport and thermoelectric properties of Zn4Sb3

Qin

2011

Intermetallics

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“…The grain size of a brittle material has great influence on its mechanical strength, which is known as the Orowan relation, r = kd À1/2 , where r, k, and d are the strength, a constant, and grain size, respectively. 15 So the mechanical strength of brittle materials can be enhanced by reducing the average grain size. In this research we measured the compressive strength of the MS-SPS-40 sample, and the data were also compared with those for the M-ingot sample.…”

Section: Mechanical Propertiesmentioning

confidence: 99%

“…However, they did not show the thermoelectric properties and mechanical durability. Hot-pressing is a typical process for preparing b-Zn 4 Sb 3 bulk material, 8,14,15 but during the long period of hot processing, it is difficult to control the amount of Zn vaporization, which could result in compositional change. In addition, some researchers have tried to fabricate b-Zn 4 Sb 3 through mechanical alloying and solid-state reaction.…”

Section: Introductionmentioning

confidence: 99%

Improved Thermoelectric Performance and Mechanical Properties of Nanostructured Melt-Spun β-Zn4Sb3

Tang

et al. 2010

Journal of Elec Materi

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b-Zn 4 Sb 3 is one of the most important thermoelectric materials in the intermediate temperature range, but poor mechanical properties limit its commercial application. In this work we adopted a melt-spinning (MS) technique followed by a quick spark plasma sintering (SPS) procedure to fabricate nanostructured b-Zn 4 Sb 3 bulk material with good thermoelectric performance and mechanical properties. The nanostructure had a significant influence on the thermoelectric transport properties and mechanical strength. Compared with the sample prepared by the traditional melting method (M-ingot), the Seebeck coefficient of the MS-SPS samples was significantly higher and the thermal conductivity was remarkably lower. In spite of the lower electrical conductivity, the r/j ratio increased in the high temperature range, leading to great improvement in the thermoelectric figure of merit (ZT). The maximum ZT value of 1.16 was obtained at 700 K for the MS-SPS-40 sample. Compared with the M-ingot sample, it was 47% higher at the same temperature. Moreover, the average compressive strength of the MS-SPS-40 sample reached 337.9 MPa, which is 130% higher than that of the M-ingot sample. b-Zn 4 Sb 3 with such high mechanical strength has great potential for commercial application.

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“…ZT is defined as ZT = α 2 σT/κ, where α, σ, T and κ are the Seebeck coefficient, electrical conductivity, absolute temperature and thermal conductivity, respectively. In previous papers [3,4], we have investigated the effects of hot-pressing conditions on thermoelectric and mechanical properties of -Zn 4 Sb 3 , and have found that the thermoelectric performance of the material can be improved by optimizing the processing parameters, while the strength remains insufficient for a TEG component even when fabricated under optimized conditions. Fracture mechanical considerations suggest that the strength would surely improve by reducing the starting particle size [4].…”

Section: Introductionmentioning

confidence: 99%