2016 17th International Conference on Electronic Packaging Technology (ICEPT) 2016 Help me understand this report
Optimization of heat transfer of microchannels in LTCC substrate with via holes and liquid metal
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“…In other researches water has been substituted by eutectic alloys of gallium or indium. The latter is called liquid metal cooling, and it shows promising results beyond the 1000 W/cm 2 [226][227][228].…”
Section: B Cold Plate Technologies For Liquid Coolingmentioning
confidence: 99%
“…In other researches water has been substituted by eutectic alloys of gallium or indium. The latter is called liquid metal cooling, and it shows promising results beyond the 1000 W/cm 2 [226][227][228].…”
Section: B Cold Plate Technologies For Liquid Coolingmentioning
confidence: 99%
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