Optimization of Contact Dynamics for an RF MEMS Switch

Pryputniewicz, Ryszard J.; Furlong, Cosme; Pryputniewicz, Emily J.

doi:10.1115/imece2002-39504

Cited by 10 publications

(4 citation statements)

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“…Computational tools, i.e., finite element methods (FEMs), boundary element methods (BEMs), and finite difference methods (FDMs), provide approximate solutions as they discretize the domain of interest and the governing partial differential equations (PDEs). The characteristics of discretization, in conjunction with the BIL conditions, influence degree of approximation and careful convergence studies should be performed to establish correct computational solutions and modeling 11 . It should be noted that both analytical and computational solutions depend on material properties.…”

Section: Tlmentioning

confidence: 99%

Advances in optoelectronic methodology for micro- and nano-scale measurements

Pryputniewicz

2007

SPIE Proceedings

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Advances in emerging technologies of microelectromechanical systems (MEMS) and nanotechnology, especially relating to the applications, constitute one of the most challenging tasks in today's micromechanics and nanomechanics. In addition to design, analysis, and fabrication capabilities, this task also requires advanced test methodologies for determination of functional characteristics of devises produced to enable verification of their operation as well as refinement and optimization of specific designs. In particular, development of miniscule devices requires sophisticated design, analysis, fabrication, testing, and characterization tools.These tools can be categorized as analytical, computational, and experimental. Solutions using the tools from any one category alone do not usually provide necessary information on MEMS and extensive merging, or hybridization, of the tools from different categories is used. One of the approaches employed in this development of structures of contemporary interest, is based on a combined use of the analytical, computational, and experimental solutions (ACES) methodology. Development of this methodology was made possible by recent advances in optoelectronic methodology, which was coupled with the state-of-the-art computational methods, to offer a considerable promise for effective development of various designs. This approach facilitates characterization of dynamic and thermomechanical behavior of the individual components, their packages, and other complex material structures. In this paper, recent advances in optoelectronic methodology for micro-and nanoscale measurements are described and their use is illustrated with representative examples.

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Section: Tlmentioning

confidence: 99%

Advances in optoelectronic methodology for micro- and nano-scale measurements

Pryputniewicz

2007

SPIE Proceedings

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“…Consequently, material properties have a direct influence on performance characteristics of a microswitch and its behavior under actual operating conditions. In fact, fabrication tolerances and accuracy of material properties have profound influence on dynamics of microswitches 24 . Analytical, computational, and experimental solutions used to determine micromechanical characteristics of …”

Section: Representative Mems Samplesmentioning

confidence: 99%

Hybrid approach to MEMS reliability assessment

Zunino

Skelton

Han³

et al. 2007

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI

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Recent advances in MEMS technology have led to development of a multitude of new devices. However applications of these devices are hampered by challenges posed by limited understanding of their reliability particularly the impacts of long-term storage. Current trend in micro/nanosystems is to produce ever smaller, lighter, and more capable devices in greater quantities and at a lower cost than ever before. In addition, the finished products have to operate at very low power and in very adverse conditions while assuring durable and reliable performance. Some of the new devices are being developed to function at high operational speeds, others to make accurate measurements of operating conditions in specific processes. Regardless of their application, the devices have to be reliable while in use. MEMS reliability, however, is application specific and, usually, has to be developed on a case by case basis. This paper presents a hybrid approach/methodology particularly suitable to quantitative studies of various aspects in MEMS reliability assessment. The presentation is illustrated with selected examples representing an initial study of reliability of specific MEMS. By quantitatively characterizing performance of MEMS, under different operating conditions, we can make specific suggestions for their improvements. Then, using the hybrid approach/methodology, we can verify the effect of these improvements. In this way, we can develop better understanding of functional characteristics of MEMS sensors, which will ensure that these sensors are operated at maximum performance, are durable, and are reliable.

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“…12 It should be noted that both analytical and computational solutions depend on material properties. If material properties are well known, then solutions typically give correct results, providing convergence was achieved subject to properly specified BIL conditions; if material properties are not well known, in spite of having a good knowledge of other modeling parameters, erroneous results may be obtained.…”

Section: Introductionmentioning

confidence: 99%

Recent advances in microdevices for transportation industry

Pryputniewicz

2011

Opt. Eng

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Advances in emerging technologies of microelectromechanical systems (MEMS) and nanotechnology, especially relating to the applications, constitute one of the most challenging tasks in today's micromechanics and nanomechanics. In addition to design, analysis, and fabrication capabilities, this task also requires advanced test methodologies for determination of functional characteristics of devices produced to enable verification/validation of their operation, as well as refinement and optimization of specific designs. In particular, development of microdevices requires sophisticated tools, especially as these devices apply to transportation industry because of stringent safety and reliability requirements. These tools can be categorized as analytical, computational, and experimental. Solutions using the tools from any one category alone do not usually provide necessary information on MEMS, and extensive merging, or hybridization, of the tools from different categories is used. One of the approaches employed in this development of structures of contemporary interest is based on a combined use of the analytical, computational, and experimental solutions methodology. Development of this methodology was made possible by recent advances in optoelectronic methodology, which was coupled with the state-of-the-art computational methods, to offer a considerable promise for effective development of various designs. This approach facilitates characterization of dynamic and thermomechanical behavior of the individual components, their packages, and other complex material structures. In this paper, recent advances in optoelectronic methodology for microscale measurements are described and their use is illustrated with representative examples. C 2011 Society of Photo-Optical Instrumentation Engineers (SPIE).

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Optimization of Contact Dynamics for an RF MEMS Switch

Cited by 10 publications

References 0 publications

Advances in optoelectronic methodology for micro- and nano-scale measurements

Advances in optoelectronic methodology for micro- and nano-scale measurements

Hybrid approach to MEMS reliability assessment

Recent advances in microdevices for transportation industry

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