1992
DOI: 10.1016/0257-8972(92)90371-g
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Optimization of arc evaporated (Ti,Al)N film composition for cutting tool applications

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Cited by 40 publications
(13 citation statements)
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“…4 In addition, it is often found that tools coated with TiAlN films provide superior overall performance on materials that are difficult to machine. 5,6 High-resolution transmission electron micrographs of Shieh et al 7 showed that the grain size of Ti 1−x Al x N films prepared by plasma enhanced chemical vapour deposition decreased to less than 10 nm as the aluminium content in the film increased up to a ratio of Al/(Al + Ti) = 0.63. Further, the hardness measurement shows that the microstructural feature was the most important factor in determining the hardness values of the films.…”
Section: Introductionmentioning
confidence: 97%
“…4 In addition, it is often found that tools coated with TiAlN films provide superior overall performance on materials that are difficult to machine. 5,6 High-resolution transmission electron micrographs of Shieh et al 7 showed that the grain size of Ti 1−x Al x N films prepared by plasma enhanced chemical vapour deposition decreased to less than 10 nm as the aluminium content in the film increased up to a ratio of Al/(Al + Ti) = 0.63. Further, the hardness measurement shows that the microstructural feature was the most important factor in determining the hardness values of the films.…”
Section: Introductionmentioning
confidence: 97%
“…(Ti,Al)N is a very successful example of this group which has been available since the late 1980s [3]. This coating is a further development of TiN and combines good oxidation and corrosion resistance with outstanding mechanical properties in the contact zone at elevated temperatures even in dry cutting operations [4][5][6][7][8][9]. Another successful commercial hard coating is Al 2 O 3 coating deposited by CVD technology, which is produced at temperatures of about 1000°C limiting the choice of substrate.…”
Section: Introductionmentioning
confidence: 98%
“…200 nm/min), a dense structure and good adhesion [2], [6], [70]. Deposition of compound materials (nitrides, oxides, etc.)…”
Section: Cathodic Arc Evaporationmentioning
confidence: 99%
“…Various applications include TiN thin film diffusion barriers, AlN in electronic semiconductor devices, (Ti,Al)N wear-resistant coatings, high temperature composites like Ti2AlN, Al3Ti, AlN, and TiN enhancing Al-base alloys, TiN embedded in steels preventing grain growth, etc [3], [6], [38], [49].…”
Section: Ti-al-n Systemmentioning
confidence: 99%
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