Optimization of an ammonia-cooled rectangular microchannel heat sink using multi-objective non-dominated sorting genetic algorithm (NSGA2)

Adham, Ahmed Mohammed; Mohd‐Ghazali, Normah; Ahmad, Robiah

doi:10.1007/s00231-012-1016-8

Cited by 53 publications

(29 citation statements)

References 19 publications

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“…It is also known from previous works, that rectangular microchannels provide the best thermal performance with lower thermal resistance [10,11]. In fact, several researchers report simulation data using this type of microchannels, but with different working fl uids, such as water, air, nitrogen, and argon, among several others.…”

Section: Total Entropy Generation Ratementioning

confidence: 99%

“…In fact, several researchers report simulation data using this type of microchannels, but with different working fl uids, such as water, air, nitrogen, and argon, among several others. Particularly, in [10] it was reported the potential improvement in the overall performance of a rectangular microchannel heat sink using ammonia gas as a coolant. From the simulation point of view, as was mentioned earlier in [12], literature reports several strategies for modeling this type of heat transfer problem, such as the thermal resistance model, fi n model, two fi n-fl uid coupled models, and porous medium model, principally.…”

Section: Total Entropy Generation Ratementioning

confidence: 99%

“…This term, found in (2), can be determined with (10), where a relation is made between pressure drop due to load loss and to channel inlet and outlet, as a function of the average density of the fluid , of the average velocity of the fluid , of the Darcy friction factor , of the length or depth of the channel , of the hydraulic diameter , and of the relation given by , respectively [13]. (10) In order to calculate the friction factor , shown in (10), the correlations given in [14] for smooth surfaces were employed.…”

Section: Total Pressure Dropmentioning

confidence: 99%

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An optimal high thermal conductive graphite microchannel for electronic device cooling

Cruz–Duarte

Amaya

Correa-Cely

2015

Rev. Fac. Ing. Antioquia

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Section: Total Entropy Generation Ratementioning

confidence: 99%

Section: Total Entropy Generation Ratementioning

confidence: 99%

Section: Total Pressure Dropmentioning

confidence: 99%

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An optimal high thermal conductive graphite microchannel for electronic device cooling

Cruz–Duarte

Amaya

Correa-Cely

2015

Rev. Fac. Ing. Antioquia

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“…They simultaneously improved the thermal and hydrodynamic efficiencies. In the same way, Adham et al (2012) boosted the performance of a heat sink by reducing the entropy generation rate 34 %, whilst also optimizing the pumping power. They managed to do so by using ammonia gas as a working fluid, instead of air.…”

Section: Introductionmentioning

confidence: 98%

“…The number of publications regarding the use of this kind of approaches in engineering is breathtaking, especially since traditional ones are unable to solve them. In the particular case of optimum design of heat sinks, a brief list is composed by Adham et al 2012, Correa et al 2011, Hinojosa et al 2012, and Khan et al 2013 This article presents an analysis of the influence of air humidity over the entropy generation of a rectangular microchannel heat sink. The model of the system was developed through the EGM criterion; and was optimized using the Spiral Optimization algorithm, because it is simple, reliable, and easy to tune.…”

Section: Introductionmentioning

confidence: 99%

Influence of moist air in copper heat sinks: Analysis through the entropy generation minimization criterion

2015

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Many factors affect heat transfer during the cooling of modern electronic devices. Today, knowledge accrues from modeling, simulation, and experimentation. This allows predicting and calculating features of heat transfer phenomena, to some extent. Examples include the amount of heat generated and removed, the required physical properties of the working fluid, and the required material properties of the heat sink, among other parameters. This article describes some simulation results of using air with a given relative humidity (10 %, 50 % and 90 %). Its influence on the heat transfer process was also analyzed. Results show a measurable effect of using humidified air instead of dry air and copper as a bulk material. The heat transfer rate increased about 20 % when using air with 90 % relative humidity passing through a rectangular microchannel heat sink made of copper.Keywords: Heat sinks, microelectronics, global optimization, entropy generation minimization, moist air. RESUMENSon muchos los factores que afectan la transferencia de calor durante el enfriamiento de los dispositivos electrónicos modernos. En la actualidad, el conocimiento acumulado proviene del modelado, la simulación, y la experimentación. Esto permite predecir y calcular características de fenómenos de transferencia de calor, hasta cierto punto. Ejemplos de ello incluyen la cantidad de calor generado y removido, las propiedades físicas necesarias para un fluido de trabajo, y las propiedades requeridas para el material de un disipador de calor, entre otros parámetros. Este artículo describe algunos resultados de simulación utilizando aire con un valor de humedad relativa dado (10, 50 y 90 %). Su influencia en el proceso de transferencia de calor también fue analizado. Los resultados muestran un efecto medible del uso de aire humedecido en lugar del aire seco y del cobre como material del disipador. La tasa de transferencia de calor incrementó alrededor de 20 %, utilizando aire con 90 % de humedad relativa que atraviesa un disipador de calor de microcanales rectangulares hecho de cobre.Palabras clave: Disipadores de calor, microelectrónica, optimización global, mínima generación de entropía, aire húmedo.

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A review of heat and fluid flow characteristics in microchannel heat sinks

Çetkin

2020

Heat Trans

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Heat transfer and flow characteristic in microchannel heat sinks (MCHS) are extensively studied in the literature due to high heat transfer rate capability by increased heat transfer surface area relative to the macroscale heat sinks. However, heat transfer and fluid flow characteristics in MCHS differ from conventional ones because of the scaling effects. This review summarizes the studies that are mainly based on heat transfer and fluid flow characteristic in MCHS. There is no consistency among the published results; however, everyone agrees on that there is no new physical phenomenon in microscale that does not exist at macroscale. Only difference between them is that the effect of some physical phenomena such as viscous dissipation, axial heat conduction, entrance effect, rarefaction, and so forth, is negligibly small at macroscale, whereas it is not at microscale. The effect of these physical phenomena on the heat transfer and flow characteristics becomes significant with respect to specified conditions such as Reynolds number, Peclet number, hydraulic diameter, and heat transfer boundary conditions. Here, the literature was reviewed to document when these physical phenomena become significant and insignificant.

show abstract

Optimization of an ammonia-cooled rectangular microchannel heat sink using multi-objective non-dominated sorting genetic algorithm (NSGA2)

Cited by 53 publications

References 19 publications

An optimal high thermal conductive graphite microchannel for electronic device cooling

An optimal high thermal conductive graphite microchannel for electronic device cooling

Influence of moist air in copper heat sinks: Analysis through the entropy generation minimization criterion

A review of heat and fluid flow characteristics in microchannel heat sinks

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