2014
DOI: 10.1016/j.applthermaleng.2014.01.005
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Optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid for power electronics cooling

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Cited by 100 publications
(30 citation statements)
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“…Also, the pumping power increased from 0.205 W to 5.365 W. Yin et al [15] designed and optimized AlN -based MCHS for power electronics packaging. Sakanova et al [16] optimized and compared three different structures of MCHS.…”
Section: Introductionmentioning
confidence: 99%
“…Also, the pumping power increased from 0.205 W to 5.365 W. Yin et al [15] designed and optimized AlN -based MCHS for power electronics packaging. Sakanova et al [16] optimized and compared three different structures of MCHS.…”
Section: Introductionmentioning
confidence: 99%
“…Based on the above assumptions, the reviewed literature [17,25,28,29], and the equation for conservation of energy given by the CFD-ACE+ software package [31], the governing equation for computing the heat transfer and fluid flow in this study can be rewritten as follows: Continuity equation…”
Section: Mathematic Modelmentioning
confidence: 99%
“…The channel inlets of the upper layer of a DL-MCHS were designed on the top of the channel outlets of the lower layer; therefore, the temperature in the lower-layer-outlet region would be reduced compared to that of the single layer leading to the temperature on the bottom wall being more uniform. Sakanova et al [25] reported an optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid as the coolant. They revealed that the thermal resistance of the heat sink with sandwich structure and counter flows was much smaller than those of the single-layer and the double-layer with unidirectional or counter flow.…”
Section: Introductionmentioning
confidence: 99%
“…For the investigated single-phased turbulent flow, standard k-e model, double precision solver and SIMPLE algorithm were applied to solve the pressure-velocity coupling equations [19][20][21]. The boundary conditions are listed below: At the inlet, velocity normal component v = 10 m/s, temperature T = 20°C.…”
Section: Thermal Simulation Of Igbt Module On Copper Microchannel Basmentioning
confidence: 99%