Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method

Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters

“…The highest stress concentration is imposed at the interfaces of solder layer. Stress values decline passing toward the center of solder joint as also reported in (Amalu et al , 2015). This appears that the solder layer center remains the most robust region while the interfaces are vulnerable to defect initiation and propagation.…”

“…Trying to measure a significant number of chosen samples, the effective thicknesses of Cu baseplate, solder joint, and power chip are measured at 1.51 mm, 80um, and 520um, respectively. It is worth carefully noting that, because of the simplicity, the bond wires were ignored without losing precision (Samavatian et al , 2018; Amalu et al , 2015). Dissimilar materials with specific thermal expansion coefficients (CTEs) can be detected to be joined by soldering that ignite thermomechanical stresses through the bodies, especially in the solder joint as the most defective part of IGBT power module (Zarmai et al , 2017).…”

Optimising Parameters for Expanded Polystyrene Based Pod Production Using Taguchi Method

“…Significance of the application of Taguchi methods and its variants in different industrial applications is evident from the works of Mota-Gutiérrez et al [26], Jeyapaul et al [27], Beyer and Sendhoff [28], and Bendell et al [29]. Among others, Taguchi's approach was considered by the researchers to address process improvement in food [30][31][32], healthcare [33], electronics [34], and manufacturing [35,36] industries.…”

Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors

“…Since, a Rainflow-sorted complex loading is considered and several loads with the distinct conditions are applied to the power device, cumulative damage models have to be utilized in order to determine the resulted damage evolution of each load. Thus, the outputs of lifetime models, namely creep and fatigue mechanisms, would be separately inserted to the cumulative damage models defined in (4) and (6). Finally, linear global damage model expressed in (7) would be employed for the useful lifetime estimation of the power semiconductor.…”

“…Many studies have been done to evaluate the effects of thermo-mechanical cycling on the reliability of solder joints in electronic packages. Amalu et al [6] investigated the thermomechanical response of solder joints in a crystalline silicon solar cell assembly using Garofalo-Arrhenius creep model. Their results indicate that the joint dimension plays a vital role in the thermo-mechanical reliability of solder joints.…”