Optimisation of the layer thickness distribution in electrochemical processes using the level set method

Abstract

This study proposes a numerical technique for the optimisation of the deposited layer thickness in electrochemical cells using the insulating shields. The aim is to develop a systematic adjustment of the insulating shield position in order to obtain a more uniform distribution of the deposited layer at the cathode. The optimal position of the insulating shield is managed by a genetic algorithm. Both the layer thickness profile and the position of the insulating shield are calculated by using the level set method. The main advantage of this technique is that during the whole computational process, the same triangular finiteelement mesh with a fixed connectivity is used. An example related to the optimisation of the layer thickness distribution in the vicinity of a singularity (incident angle between the electrode and insulator ¼ 1808), using an insulating shield is presented.

Review—Electroforming Process for Microsystems Fabrication

“…123 Despite the different methods that were evaluated in the years that followed, the level set method (LSM) and the finite element method (FEM) have remained the two most common numerical techniques. 124 Deconinck later established the boundary element method (BEM) to simulate developing electrode profiles with non-linear boundary conditions. 125 The two more well-known commercial programs for modelling electrochemical systems and processes are Elsyca ® and COMSOL Multiphysics ® , even though several organizations have produced models for electrodeposition.…”

Modelling the electroforming process: significance and challenges

“…Regardless of the various approaches tested in the following years, two numerical techniques have been prevalent: the level set method (LSM) [7]- [14] and the finite element method (FEM). The latter has been the favoured by researchers due to its flexibility in combining different theoretical models to solve various boundary problems.…”

“…It was the study of Behagh et al [14] that went the extra mile and successfully developed a 2D model which could simulate the thickness, as well as the primary and secondary current density during nickel electroforming of a revolving part. They proposed a linear correlation of the electroformed part's thickness and primary current density.…”