Optimal Thermo-Structural Analysis for High Density Package Mounting on Build-up Board

Abstract

The importance of the high density packaging technology and mounting technology on the printed wiring build-up board has been increased for the consumer electric products. On the other hand, the chance to use the build-up boards for mounting the high density packages has been increased. However, the understanding that the reliability of the solder connection depends on the structure of the package, the motherboard, and the material properties, is not very high.In this paper, the reliability for high density packaging, mounted on the build-up board, is assessed. The compact numerical analysis model for the reliability assessment is suggested and the most reliable packaging design with optimizing each of the parameters is reported. For introduction to the reliability assessment of the FCA attachment, ceramic and silicon are compared as the inter-poser with the parameter of the solder height. The verification of the numerical analysis results using tests on the actual hardware is also shown. And the established numerical analysis model is applied to the study of influence of the copper balance between the front side and the back side copper layers.

Material Properties Reliance Improving Numerical Analysis Accuracy

“…The encapsulant is shown in red. Four outer-most lead free solder balls are modeled in detail, and the remains are modeled with rough elements [1][2][3] , shown in Fig.3. The meshing sample is shown in Fig.4.…”

“…That brings the sufficient data to be able to assess the parameters to control the design feasibility and the reliability. (2)(3)(4) In this paper, we report the importance and the reliance of material properties, in which are used in the numerical analysis. In the development activity, the numerical analysis was performed on the view point of the reliability assessment.…”

Optimization approach of LCD hinge bracket with numerical analysis for mobile notebook

“…The numerical analysis is one of the beneficial tools for supporting these understanding and design parameters optimization [3]- [6]. We are able to approach the deep study with numerical analysis and actual hardware testing.…”

Influence of VIA stacking for high density of consumer electronics products

“…In this assessment, a compact modeling and analysis method intended to reduce the time needed for nonlinear numerical analysis was applied [2][3][4] to VIA joints which are very small compared to the whole structure.…”

“…Therefore, a numerical analysis of stressed copper was performed by the nonlinear FEM (Finite Element Method) in order to evaluate the influence of stacked VIAs on the reliability of packages and build-up boards with regard to fatigue fracture caused by temperature cycling stress. In this assessment, a compact modeling and analysis method intended to reduce the time needed for nonlinear numerical analysis was applied [2][3][4] to VIA joints which are very small compared to the whole structure.…”