Optimal thermo-mechanical reliability design of 2.5D lidless package

Yang, Junbo; Cai, Chongyang; Yin, Pengcheng; Pan, Ke; Lai, Yangyang; Wang, Jing; Park, Seungbae

doi:10.1109/itherm54085.2022.9899678

Cited by 6 publications

(1 citation statement)

References 18 publications

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“…The authors additionally employed a design technology co-optimization method (DTCO) to identify the dominant factors affecting the fatigue life of the solder joints under TCoB testing. Yang et al [ 25 ] used a validated 3D FE model to analyze the solder joint plastic work energy of a lidless 2.5D package with a heat sink in board-level thermal cycling tests. The results showed that the solder fatigue life increased as the pre-load force of the bolts and CTE mismatch between the substrate and PCB reduced.…”

Section: Introductionmentioning

confidence: 99%

Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions

et al. 2023

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Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous integration packages, are widely used in high I/O (Input/Output) density and high-performance computing applications. The thermal dissipation efficiency of such packages is often improved through the use of an external heat sink. However, the heat sink increases the solder joint inelastic strain energy density, and thus reduces the board-level thermal cycling test reliability. The present study constructs a three-dimensional (3D) numerical model to investigate the solder joint reliability of a lidless on-board FCBGA package with heat sink effects under thermal cycling testing, in accordance with JEDEC standard test condition G (a thermal range of −40 to 125 °C and a dwell/ramp time of 15/15 min). The validity of the numerical model is confirmed by comparing the predicted warpage of the FCBGA package with the experimental measurements obtained using a shadow moiré system. The effects of the heat sink and loading distance on the solder joint reliability performance are then examined. It is shown that the addition of the heat sink and a longer loading distance increase the solder ball creep strain energy density (CSED) and degrade the package reliability performance accordingly.

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Section: Introductionmentioning

confidence: 99%