Optimal thermal design of a horizontal fin heat sink with a modified-opening model mounted on an LED module

Jeong, Minsu; Jeon, Seung Won; Kim, Yong Chan

doi:10.1016/j.applthermaleng.2015.08.001

Cited by 45 publications

(13 citation statements)

References 22 publications

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“…Besides, high junction temperature also accelerates the lumen degradation. Thus, thermal management becomes one of critical research focuses for LEDs from chip to systems [1,4,[15][16][17][18]. The optical and chromatic performances of an individual LED package is directly influenced by its driven current and surrounding temperature.…”

Section: Introductionmentioning

confidence: 99%

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Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model

Fan¹,

Chen²,

Yuan³

et al. 2020

Opt. Express

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Light-emitting diode (LED) arrays have attracted increased attention in the area of high power intelligent automotive headlamps because of their superiority in disposing of the power limit of an individual LED package and controllably luminous intensity and illumination pattern. The optical and chromatic performances of an LED array do not equal to the sum of individual LED packages' performances, as the thermal interactions between individual LED packages can't be ignored in the actual application. This paper presents a thermal-electrical-spectral (TES) model to dynamically predict the optical and chromatic performances of the LED array. The thermal-electrical (TE) model considering the thermal coupling effect in the LED array is firstly proposed to predict the case temperature of each individual LED package, and the Spectral power distributions (SPDs) of individual LED package is then decomposed by the extended Asym2sig model to extract the spectral characteristic parameters. Finally, the experimental measurements of the designed LED arrays operated under usage conditions are used to verify the TES model. Some validation case studies show that the prediction accuracy of the proposed TES model, which is expressed as a quadratic polynomial function of current and case temperature, can be achieved higher than 95%. Therefore, it can be concluded that this TES model offers a convenient method with high accuracy to dynamically predict the optical and chromatic performances of LED arrays at real usages.

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Section: Introductionmentioning

confidence: 99%

“…83 17. 15.40 13.76 13.41 14.51 15.34 16.80 82.49 14.70 13.90 14.87 13.88 13.60 14.80 83.14 14.91 14.01 12.95 13.18 14.22 13.96 70.71 15.03 13.54 14.06 14.92 13.96 14.73 83.13 14.90 14.96 14.12 13.08 13.39 15.11 83.07…”

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Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model

Fan¹,

Chen²,

Yuan³

et al. 2020

Opt. Express

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“…Therefore, a solid is generally used as the interface contact heat dissipation material. (6,7) Since the heat transfer is still limited, some special high-thermal-conductivity materials or high cooling methods (8)(9)(10)(11)(12) should be used to enhance the efficiency. Therefore, some technologies, such as heat pipes, vapor chambers, refrigeration, air conditioning, sprays, phase materials, thermal pads, thermoelectric coolers, and microchannels, (13)(14)(15)(16)(17)(18)(19)(20)(21)(22)(23)(24) for assisting the cooling element to achieve heat dissipation and a special new technology to increase performance have been developed.…”

Section: Introductionmentioning

confidence: 99%

Using Graphene-powder-based Thermal Interface Material for High Lumen LED Array Chip: An Experimental Study of Heat Dissipation

Hsu¹,

Chen²,

Chang³

et al. 2020

Sensors and Materials

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“…The following serves as an illustration of natural convective cooling for LEDs (Jeong et al, 2015). Their numerical study proposed a cooling method that improved upon the poor ventilation and heat dissipation of a horizontal fin heat sink mounted on an LED module with natural convection.…”

Section: Introductionmentioning

confidence: 99%

Thermo-fluid dynamics of pulsating heat pipes for LED lightings

Yamagami

Inoue

Yoshiyama

2016

Mechanical Engineering Journal

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An effectual thermal management is a very important issue in a light emitting diode (LED) floodlight because its performance and reliability decrease significantly as the junction temperature increases. A cooling device free of moving parts is suitable for lighting with natural convection. A very large heat sink is combined with a relatively small light source in high-power LED floodlights with everlasting miniaturization of microelectronic systems and highly developed high-density packing technology. Pulsating heat pipes (PHPs) lead to a breakthrough solution for passive two-phase flow spreading of LEDs non-radiant heat in case of a high-density mounting device. PHPs have little influence of gravity direction (floodlight attitude), high heat spreading performance, high reliability for long-term use, lightweight, low cost, and ease of production. This paper describes closed loop 8-turn, ethanol-charged PHPs with radial channels. The experimentally investigated PHPs have dimensions of 200 mm × 200 mm × 3 mm with central heating using a diameter of 38 mm heater. A copper plate is covered with polycarbonate plate for visual observations. A time-strip image processing technique has been applied to the flow videos to extract qualitative details of flow regimes concerning the liquid/vapor interface dynamics. Radial channel flow and thermal oscillation characteristics have been discussed using time-strip technique, Fourier power spectrum and autocorrelation function. The U-shaped vapor oscillates in the cooling section. The wall temperature-time histories fluctuate non-periodically.

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Optimal thermal design of a horizontal fin heat sink with a modified-opening model mounted on an LED module

Cited by 45 publications

References 22 publications

Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model

Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model

Using Graphene-powder-based Thermal Interface Material for High Lumen LED Array Chip: An Experimental Study of Heat Dissipation

Thermo-fluid dynamics of pulsating heat pipes for LED lightings

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