Optimal Mechanical Design of Electronic Devices for Shock Protection

Baranyai, Tamás; Várkonyi, Péter L.

doi:10.1109/tcpmt.2018.2864574

Cited by 2 publications

(1 citation statement)

References 26 publications

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“…In 2011, J. Wang et al [142] analyzed the shock load transfer model of electronic equipment in the three-axis direction using the shock response spectrum (SRS). In 2018, Baranyai et al [143] proposed a mechanical model and anti-drop design of electronic systems. In 2020, Y. Shi et al [144] published a system-level modeling of MEMS accelerometers under high-g shocks.…”

Section: System-level Modeling and Optimizationmentioning

confidence: 99%

Reliability of MEMS in Shock Environments: 2000–2020

Peng

You

2021

Micromachines

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The reliability of MEMS in shock environments is a complex area which involves structural dynamics, fracture mechanics, and system reliability theory etc. With growth in the use of MEMS in automotive, IoT, aerospace and other harsh environments, there is a need for an in-depth understanding of the reliability of MEMS in shock environments. Despite the contributions of many articles that have overviewed the reliability of MEMS panoramically, a review paper that specifically focuses on the reliability research of MEMS in shock environments is, to date, absent. This paper reviews studies which examine the reliability of MEMS in shock environments from 2000 to 2020 in six sub-areas, which are: (i) response model of microstructure, (ii) shock experimental progresses, (iii) shock resistant microstructures, (iv) reliability quantification models of microstructure, (v) electronics-system-level reliability, and (vi) the coupling phenomenon of shock with other factors. This paper fills the gap around overviews of MEMS reliability in shock environments. Through the framework of these six sub-areas, we propose some directions potentially worthy of attention for future research.

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Section: System-level Modeling and Optimizationmentioning

confidence: 99%

Reliability of MEMS in Shock Environments: 2000–2020

Peng

You

2021

Micromachines

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Phenomenological Modeling of Carpeted Surface for Drop Simulation of Portable Electronics

Sirimamilla

2019

Journal of Electronic Packaging

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Using finite element (FE) analysis to simulate drop impact is widely adopted by the consumer electronics industry in the design process of portable devices. Most of such simulations model impact surface as a rigid or simple elastic surface. While this approach is valid for many common hard surfaces such as wood, tile, or concrete, it often does not provide a realistic risk assessment if the impact surface is a soft surface such as carpet. This paper describes a methodology to create a material model for carpeted impact surface that is suited for FE drop simulation. A multilayer hyperelastic–viscoelastic material model is used to model the mechanical response of the carpet under mechanical impact. Quasi-static and impact testing on the industrial carpet were performed to calibrate the model parameters with the help of optimization. Validation of the model was done by comparing the simulation predictions with measurements from the impact tests performed at different heights. Much better correlation between experimental measurements and simulation predictions were observed when using the multilayer hyper-viscoelastic model for carpet than using a single layer homogenous model. This approach can provide a better estimate and a more accurate representation for device drop risk on carpeted surfaces for design and development of portable products. The methodology can also be used to derive material models for other similar impact surfaces.

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Optimal Mechanical Design of Electronic Devices for Shock Protection

Cited by 2 publications

References 26 publications

Reliability of MEMS in Shock Environments: 2000–2020

Reliability of MEMS in Shock Environments: 2000–2020

Phenomenological Modeling of Carpeted Surface for Drop Simulation of Portable Electronics

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