Abstract:As the trend of miniaturization of electronic components has grown, demands for advanced microelectronics packaging development have also increased. At the same time, however, this trend raises concerns of unreliable assembly processes that are caused by defective packaging interconnections. In particular, the defects can be induced by non-coplanarity and unpredictable structural deformation of interconnections. When a slope of the die exceeds a certain degree, connectivity between components in the package ma… Show more
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