Optimal Design of Broadband Microwave Baluns Using Single-Layer Planar Circuit Technology

Common-mode termination requirements in concurrent dual-band push-pull power amplifiers

“…Systems such as those that prevent this efficiency loss from the commonmode do exist, but they have never been designed intentionally. Mostly the systems that can prevent this are ones with very broad common-mode impedance attributes, but they've not been used to combat this problem [12,13,14]. Other systems that are capable of preventing this are designed to specifically filter exact frequencies within the common-mode, but once again, the problems they were designed to address are different than the ones shown in Chapter III [32].…”

“…As was stated earlier, designers working in the gigahertz ranges who want to take advantage of The flexibility of this structure is one of its advantages, many researchers have developed numerous ways to configure these baluns to fit nearly any frequency and impedance [21,24]. To begin the design of this balun you first need to determine the physical quarter wavelength of the center frequency, almost all the other parameters of this balun are governed by the limits of your manufacturing process.…”

Systematic design of 7‐to‐40‐GHz on‐chip mixer based on optimal impedance deviation coefficient

“…Marchand balun was first proposed in 1944 . For the next several decades, theoretical researches and innovation in structure in all directions about Marchand baluns have been presented in literature . At the very beginning, the analysis about Marchand balun was established in the equivalent circuits of the coaxial‐line topology and then was widely used in un‐planar or quasi‐planar circuits which are relatively easy fabricated in, for example, printed‐circuit‐board (PCB) technology but hard in III‐V compound integrated circuits (ICs) technology with only two metal layers and a ground plane which cannot be arbitrarily modified.…”

“…7 For the next several decades, theoretical researches and innovation in structure in all directions about Marchand baluns have been presented in literature. [8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24] At the very beginning, the analysis about Marchand balun was established in the equivalent circuits of the coaxial-line topology 8,9 and then was widely used in un-planar 10,11,14 or quasiplanar circuits 12,13 which are relatively easy fabricated in, for example, printed-circuit-board (PCB) technology but hard in III-V compound integrated circuits (ICs) technology with only two metal layers and a ground plane which cannot be arbitrarily modified. After 2000, theoretical researches based on coupled-line equivalent-circuit models about planar Marchand baluns are increasingly reported in literature for applications in planar-structure circuits.…”

High Efficiency GaN 2.5 to 9 GHz Power Amplifiers Realized in Multilayer LCP Hybrid Technology

“…The limited number of low-loss metal layers in the majority of standard MMIC processes requires planar implementations of baluns and couplers, which constrain the realizable design parameters such as coupling factor, insertion loss, bandwidth, and impedance level [6]. Multilayer LCP structures allow for low-loss broadside coupled elements which can mitigate the limits of planar circuits.…”