Optimal analysis of adhesive lightweight joints

Abstract

In the present paper the behavior of the piezoelectric response of smart lightweight structures consisting in a piezoelectric patch over a host layer under static load and affected by electrical load at environment conditions is studied. The shear lag analysis is applied to investigate the possible interface delamination and to calculate analytically the interface debond length. It has been demonstrated that the roots of respective characteristic equation play a leading role for place of the interface delamination in the overlap zone of the structure under consideration. This leads to the conditions for the actual deboning existence and opens the possibility of an optimal analysis. The proposed approach consists in involving the shear lag model in a global optimization framework where simultaneously the investigation of all model parameters can be carried out. The solution of that problem gives the values of the parameters at which a vanishing/minimal debond length is ensured. The efficiency of the proposed method is proved on three different examples as the optimal geometrical characteristics and effects ensuring no delamination in the structures are obtained.

Influence of the geometry and the frequency range on the interface delamination in smart patch/layer structures under combined dynamic loading

“…The proved performance of the shear lag method in the case of static loading of smart hygropiezothermal elastic patch/layer configurations has encouraged us to extend this method and to apply it for the investigation of the piezoelectric response of the above mentioned smart structures under combined dynamic time harmonic load, electric field at environment conditions.…”

Analytical modeling of graphene/PMMA nanocomposite under hygrothermomechanical loading

“…The possible interface delamination in the structure can be checked by satisfying the condition for the shear stress of the adhesive layer to be equal to its critical value: 𝜎 (𝑎) 𝑥𝑦 (𝑥) = 𝜎 (𝑎) 𝑈𝑆𝑆 (16) where 𝜎 (𝑎) 𝑈𝑆𝑆 is the ultimate shear strength of the adhesive. The value of x for which Equation ( 16) holds is the debond length of delamination.…”

“…When the structure is subjected to a larger strain, a nonlinear shear-lag model has to be applied. [10][11][12][13][14] The excellent performance of shear lag method for smart hygropiezothermal elastic patch/layer structures under static/dynamic loading [15][16][17][18] motivates the authors of this work to extend the further approach by introducing of 2D analytical stress-function variational method. [19][20] In the current paper, this method has been applied to predict the hygrothermomechanical behavior of graphene/polymer nanocomposites with possible interface delamination along the overlap zone of the structure considered.…”