“…Chemical reactions at metal/perovskite interfaces are quite common, even in the case of noble metals, and their impact on the performance and stability of devices can be catastrophic . The halogen, halide, and other volatile species generated in the presence of humidity, oxygen, and/or light even in encapsulated films can diffuse to the electrodes, leaving behind vacancies in the perovskite layer, causing the corrosion of the metal and, in some cases, the formation of redox couples with the perovskite. ,− The metal particles have also been found to diffuse into the perovskite film under heat and/or light and react to produce metal halide species or other defect states. , The electrochemical reactions between the gold electrodes and mobile halogen species are accelerated under external biasing and the introduction of different buffer layers has been proposed to prevent these reactions. ,,, The reduction in the injection barrier due to the intrinsic SAM dipoles and the inhibition of the interfacial reactions contribute to the lowering of the contact resistance in FETs with PFBT-treated contacts, as observed in Figure b, but separating between the two is difficult at the moment. Nevertheless, it is evident that the use of SAMs for contact modifications could play a pivotal role in the development of perovskite applications given the reduced complexity of the fabrication process and the fact that they allow great tunability of the electrode work function.…”