Optical Sensing Techniques For 3-D Machine Vision

Halioua, Maurice; Liu, Hsin-Chu

doi:10.1117/12.938785

Cited by 18 publications

(6 citation statements)

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“…Here we assume that the reference plane is perpendicular to plane P the plane that contains the optical axes of both the camera and the illumination. (2) where the angles and c are as shown in Fig. 1.…”

Section: D Measurementmentioning

confidence: 98%

“…There have been a few inspection mechanisms proposed for wafer bumps: laser triangulation [5,13,14], confocal microscopy [4,6,7,10,12], and gray-level pattern projection [1,2,3,8,9,11]. However, laser triangulation is of low speed and low resolution, confocal microscopy involves moving parts and has limitation in its operation speed, and gray-level pattern projection has the problems of image brightness saturation and high sensitivity to noise.…”

Section: Introductionmentioning

confidence: 98%

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Three-dimensional reconstruction of wafer solder bumps using binary pattern projection

Cheng

Chung

Lam³

et al. 2005

SPIE Proceedings

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As the electronic industry advances rapidly, the shrunk dimension of the device leads to more stringent requirement on process control and quality assurance. For instance, the tiny size of the solder bumps grown on wafers for direct die-todie bonding pose great challenge to the inspection of the bumps' 3D quality. Traditional pattern projection method of recovering 3D is about projecting a light pattern to the inspected surface and imaging the illuminated surface from one or more points of view. However, image saturation and the specular nature of the bump surface are issues. This paper proposes a new 3D reconstruction mechanism for inspecting the surface of such wafer bumps. It is still based upon the light pattern projection framework, but uses the Ronchi pattern a pattern that contrasts with the traditionally used gray level one. With the use of a parallel or point light source in combination with a binary grating, it allows a discrete pattern to be projected onto the inspected surface. As the projected pattern is binary, the image information is binary as well. With such a bright-or-dark world for each image position, the above-mentioned difficult issues are avoided. Preliminary study shows that the mechanism holds promises that existing approaches do not.

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Section: D Measurementmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 98%

Three-dimensional reconstruction of wafer solder bumps using binary pattern projection

Cheng

Chung

Lam³

et al. 2005

SPIE Proceedings

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show abstract

“…Implementation of such a system is deseribed in detail in [156). The loeal phase in an image may be estimated by taking N images, eaeh with the projector grating shifted laterally by a distanee eorresponding to a phase shift of tr radians.…”

Section: Introductionmentioning

confidence: 99%

Object Recognition

Bennamoun

Mamic

2002

Advances in Pattern Recognition

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“…Especially, the advent of phase-shifting technique has made the practical use of shadow moire method forward a further step. However, normally phase shifts are introduced by the complex and slow mechanical movement [3][4][5], so the measurement with high accuracy and speed can't be easily achieved. In this paper, a new flash phase-shifting method has been proposed, this novel technique will enable us to meet the industry's on-line measurement requirements.…”

mentioning

confidence: 99%

“…In this paper, a new flash phase-shifting method has been proposed, this novel technique will enable us to meet the industry's on-line measurement requirements. In order to get the quantitative data z (object height), the phase-shifting technique is employed [3][4][5]. From Eq.…”

mentioning

confidence: 99%

<title>New moire method for industry online measurement</title>

et al. 2001

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Here a new flash phase-shifting method has been proposed. In this method, the phase difference between three consecutive Moire images is achieved by changing the illumination angles. A theoretical derivation is presented, and certain formulas are obtained to calculate 3D information of the measured object. The special phase unwrapping algorithm connected with this phase shifting method is also solved out. At last, experiment results have been given to compare with theory derivation.

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Optical Sensing Techniques For 3-D Machine Vision

Cited by 18 publications

References 0 publications

Three-dimensional reconstruction of wafer solder bumps using binary pattern projection

Three-dimensional reconstruction of wafer solder bumps using binary pattern projection

Object Recognition

<title>New moire method for industry online measurement</title>

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