Ohmic losses and high direct current conductivity. Nevertheless, some inherent downsides of gold and silver limit their use for practical applications. First, the noble nature makes the application cost of gold and silver nanostructures relatively high. Second, gold and silver are not compatible with standard silicon manufacturing process because they can diffuse into silicon to form deep traps which severely jeopardize the performance of nanoelectronic devices. [9][10][11] Third, nanostructured gold and silver have poor thermal stability. [12] The shape of gold and silver nanostructures is prone to evolve into spheres at elevated temperature. Such transformation should be avoided in LSPR applications because the LSPR properties are highly dependent on the shape of nanostructures. [13] Because of these shortcomings of conventional gold and silver plasmonic materials, many efforts have been devoted to searching for alternatives. [14][15][16] Titanium nitride, which is well known for its excellent hardness (covalent TiN bonding), high electric conductivity, high chemical and thermal stability (melting temperature ≈3000 °C), [12] has been extensively used in microelectronics and as hard coatings. [17,18] TiN has similar optical properties to gold, reflected by that the bulk TiN has golden color, and the TiN nanostructures have comparable resonance peak to the gold counterparts. [19] Hence, titanium nitride exhibits good plasmonic properties in the visible and longer wavelengths. [14][15][16]19] Compared with gold and silver, metal nitrides are low-cost and compatible with silicon. Particularly, the refractory nature endows metal nitrides with excellent thermal stability. In addition, the dielectric properties of titanium nitride can be tuned by varying its stoichiometry, [20] which increases another way to tune the plasmon resonances. Therefore, titanium nitride is believed to be a promising plasmonic material which can overcome the drawbacks of gold and silver. However, titanium is extremely active to react with oxygen, which makes the preparation of titanium nitride very difficult. Although titanium films with patterns are readily prepared by chemical vapor deposition, [21] atomic layer deposition, [22] and physical vapor deposition, [23] it is quite challenging to prepare free titanium nitride nanoparticles with uniform and controllable size. Compared with titanium films, titanium nitride nanoparticles are highly desired in many photochemical and biological applications because of their solution dispersible nature and LSPR. In spite of that titanium nitride nanoparticles have been prepared by reactive laser ablation and various plasma technique;, [24,25] As one kind of alternative to conventional metals, titanium nitride offers many advantages in the rapidly growing fields of plasmonics and metamaterials. However, the development of TiN x -based plasmonics is severally limited by the difficulty in the preparation. Herein, a facial approach is developed for the preparation of Au@TiN x core-shell nanostructures. T...