Optical and surface analysis techniques such as infrared spectroscopy, ellipsometry and Auger electron spectroscopy (AES) and x-ray photoelectron spectroscopy (XPS) have been used to study the way in which excess Si is incorporated in nonstoichiometric Si02 films deposited by a low pressure chemical vapor deposition technique. It has been found that for this range of silicon content, the Si atoms in excess either cluster into a well-defined second phase embedded in a Si03 matrix, or form a SiO type of material depending on the postdeposition thermal treatments given to the film. The oxides are deposited at a substrate temperature in the range of 650 to 750°C using a mixture of N70 and SiH4 gases. The excess Si is introduced by reducing the nitrous oxide to silane gas ratio during the deposition (this ratio was in the range of 4 to 200). After deposition, a densification process consisting of a 1000°C anneal in a nitrogen ambient for 30 mm was given to some of the samples. The refractive index, as determined by ellipsometry, is sensitive to the excess of silicon in the films, although its behavior was similar for both annealed and as-deposited samples. The volume percent of excess silicon was estimated using spectroscopic ellipsometry for some samples. Infrared spectroscopy, on the other hand, shows a clear shift of the stretching vibration peak of Si-O-Si bonds toward lower wave numbers as the Si excess in the film is increased in the case of as-deposited films, while the annealed samples do not present this effect. Also, as-deposited samples show an absorption peak, at 890 cm', that could be associated with partially oxidized silicon. AES and XPS spectra show a distinct difference in the peaks associated to Si bonded to either oxygen or another silicon atom for both types of samples indicating that at least a considerable part of the excess Si in the as-deposited samples is in the form of SiO, while in the annealed samples it is mostly forming a second phase within a silicon dioxide matrix.
InfroductionTwo-phase Si/Si07 materials with an atomic percent (a/o) content of silicon in the range of 50 to 100%, generically known as polycrystalline silicon (SIPOS), has been extensively studied because of its electronic passivation properties on planar devices.1-4 Considerably less optical and structural characterization has been performed for lower concentrations of excess silicon (nonstoichiometric oxide), even though the electrical characteristics of Si07 films are considerably modified when excess silicon is introduced into them!2 The proposed applications for this material range from nonvolatile memories to electric field enhancers at the interface with SiO,, layers depending on the amount of excess silicon present in the film.'3 In particular, off-stoichiometric oxides with about 6% atom Si in excess have been proposed as the charge-transferring layer into a floating gate of a nonvolatile memory because the substantial reduction in permanent charge trapping as well as the highly nonlinear I-V characteristi...