Optical pin interface for 90-deg optical path conversion coupling to Printed Wiring Board

Mikami, Osamu; Yaacob, Yuzafirah; Baharudin, Nurul Atiqah; Ambran, Sumiaty; Fujikawa, Chiemi

doi:10.1109/tencon.2016.7848434

Cited by 3 publications

(4 citation statements)

References 7 publications

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“…This approach has great advantages for position alignment as the pillars were fabricated to fit precisely [23][24][25] without additional altering. Previous studies [26][27][28][29][30] also elaborated on fabrication using a masktransfer SWW. The extended mask-transfer SWW improves the contact exposure of the UV-curable resin by a current photomask, and is developed from "classic" fiber-SWW A photomask with designated apertures was put on the UV-curable resin on the substrate, as shown in Fig.…”

Section: Proposed Fabrication Methods Of Microlenses On Optical Pillarsmentioning

confidence: 99%

UV-curable resin microlenses on optical pillars for optical interconnect

Baharudin

Fujikawa

Mikami

et al. 2019

Jpn. J. Appl. Phys.

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A unique combination of pillar and microlens is demonstrated to enable easy coupling between VCSEL layers and a multi-layer/channel optical printed wiring board. A number of uniform pillars having a microlens on the top were fabricated on a substrate using UV-curable resin by masktransfer self-written waveguide and dipping methods. Ray-trace analysis indicated that the focusing characteristics could be controlled by adjusting the pillar height and the microlens radius of curvature. Tolerance coupling efficiency between pillar height and microlens radius of curvature is acceptable. Light propagation measurements showed that uniform power was obtained from all top microlenses of the 3 × 4 pillar array on a slide glass. Studies of the reproducibility of microlens-on-pillar fabrication using the dipping method show a positive outcome. As a result, optical coupling efficiency is expected to be improved in optical interconnect applications.

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Section: Proposed Fabrication Methods Of Microlenses On Optical Pillarsmentioning

confidence: 99%

UV-curable resin microlenses on optical pillars for optical interconnect

Baharudin

Fujikawa

Mikami

et al. 2019

Jpn. J. Appl. Phys.

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“…The technology for on board level; especially in Printed Circuit Boards (PCBs) has evolved rapidly from copper to optical wiring. Conventional copper wiring is influenceable by crosstalk and skin effects [1,2]. Even though optical wiring has many advantages over copper wiring, such as insusceptibility to Electromagnetic Interference (EMI), cost-effectiveness, high bandwidth operation and being a density system [3], the optical connection has raised questions about its potential as an easy coupling and fine alignment between optical wiring and optical devices.…”

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confidence: 99%

“…To solve this issue, a 90-degree optical path conversion optical pin was introduced as the practical optical interconnect for Opto-electronics (OE) PCB [1,4,5]. It has the ability to increase coupling efficiency and tolerance.…”

mentioning

confidence: 99%

“…The 45-degree optical pin interface enables a 90-degree optical path conversion coupling. In the future, it is expected that various multi-directional couplings of optical path conversion and optical path branching * E-mail: nnhuda3@live.utm.my functions will be implemented in optical interconnect technologies on board level [1,7]. However, it is worthwhile to pursue proposing a new architecture of the optical pin interface, the V-shape cut type optical pin.…”

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A V-Shape Optical Pin Interface for Board Level Optical Interconnect

et al. 2018

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This paper introduces a new interface of an optical pin for Printed Circuit Boards (PCBs), the V-shape cut type which is an innovation from the 90-degree cut type optical pin. The effectiveness is determined by optical characteristics through OptiCAD and by experiment. The simulation used a model of ray tracing analysis which is a one to two (split) connection function model. For the experiment, a Polymer Optical Fibre (POF) V-shape optical pin has been fabricated. It was found that the V-shaped optical pin has a multi-branched function and is applicable to optical interconnection. Full Text: PDF ReferencesMikami, O., et al. Optical pin interface for 90-deg optical path conversion coupling to Printed Wiring Board. in Region 10 Conference (TENCON), 2016 IEEE. 2016. IEEE. CrossRef DeCusatis, C., Data center architectures, in Optical Interconnects for Data Centers. 2017, Elsevier. p. 3-41. CrossRef Duranton, M., D. Dutoit, and S. Menezo, Key requirements for optical interconnects within data centers, in Optical Interconnects for Data Centers. 2017, Elsevier. p. 75-94. CrossRef ITOH, Y., et al., Optical Coupling Characteristics of Optical Pin with 45° Micro Mirror for Optical Surface Mount Technology. Journal of The Japan Institute of Electronics Packaging, 2001. 4(6): p. 497-503. CrossRef Uchida, T. and O. Mikami, Optical surface mount technology. IEICE Transactions on Electronics, 1997. 80(1): p. 81-87. CrossRef Papakonstantinou, I., et al., Low-cost, precision, self-alignment technique for coupling laser and photodiode arrays to polymer waveguide arrays on multilayer PCBs. IEEE Transactions on Advanced Packaging, 2008. 31(3): p. 502-511. CrossRef Nakama, K., et al., Optical connection device. 2006, Google Patents. DirectLink Ramaswami, R., K. Sivarajan, and G. Sasaki, Optical networks: a practical perspective. 2009: Morgan Kaufmann. DirectLink Tong, X.C., Advanced materials for integrated optical waveguides. 2014: Springer. CrossRef

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