2012
DOI: 10.1088/1757-899x/28/1/012007
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Optical glass surfaces polishing by cerium oxide particles

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Cited by 14 publications
(9 citation statements)
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“…Ceria (CeO 2 )-based materials are widely used in various technological fields, primarily in catalytic applications in the environmental, energy, and hydrogen production fields, 1,2 as abrasives in the glass polishing 3,4 and as biocompatible materials for medical uses. 5−7 All these applications involve either liquid or gaseous water as a reagent, product, solvent, or simply as a moisture influencing (positively or negatively) the final properties and functions of ceria.…”
Section: Introductionmentioning
confidence: 99%
“…Ceria (CeO 2 )-based materials are widely used in various technological fields, primarily in catalytic applications in the environmental, energy, and hydrogen production fields, 1,2 as abrasives in the glass polishing 3,4 and as biocompatible materials for medical uses. 5−7 All these applications involve either liquid or gaseous water as a reagent, product, solvent, or simply as a moisture influencing (positively or negatively) the final properties and functions of ceria.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, clean, smooth, and reproducible sample surfaces are desirable for various surface science studies of materials, e.g., corrosion, adsorption, lm deposition, etc. 8,[12][13][14][15][16] The effect of ceria abrasive slurry consistency in optical glass polishing was investigated by Wang et al who observed that the material removal rate increases with a decrease of the ceria concentration. 8 CMP appears to be the most promising technology in microelectronic fabrication for the planarization of globally complex device topographies.…”
Section: Introductionmentioning
confidence: 99%
“…6 Ceria is the most widely used abrasive for the CMP of silicate glasses, 7 to nish CRT screens, in LCDs and it is extensively used in ophthalmic industry for prescription lens polishing. 8 CMP appears to be the most promising technology in microelectronic fabrication for the planarization of globally complex device topographies. 9 Ceria slurries have stimulated widespread interest because of enhancements in the material removal rate, surface nish, and selectivity over slurries formulated with silica abrasives.…”
Section: Introductionmentioning
confidence: 99%
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“…Cerium oxide pellets [8] or soft-magnetic particles with magnetorheological fluid [9] could be used to make the polishing process more effective, yet these technologies can cause trouble in CNC polishing machining. The elastic properties of the pad material change in the polishing time, but they do not have the main influence on the surface quality [10].…”
Section: Introductionmentioning
confidence: 99%