Current Developments in Optical Fiber Technology 2013
DOI: 10.5772/54246
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Optical Fibre on a Silicon Chip

Abstract: Parameter CharacteristicsTypical composition 250ml HF (49.2 wt%) + 500ml HNO 3 (69.5 wt%) + 800ml CH 3 COOH [3]Etch rate 4um/min -20um/min (at room temperature and increases with agitation) [4] Surface roughness Rough-with more proportion of HNO 3 Smooth -with more proportion of HF [1]Temperature dependent 10-20Kcal/mol activation energy for concentrated HNO 3 , and 4Kcal/mole for concentrated HF [5]Masking material Silicon-nitride is the best mask material with only 10 o A-100 o A/min etches rates in HNA.

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“…The center of the fiber should be positioned in such a way as to take into account the thickness of the polymer layers and the position of the guiding layer. According to figure 1(a) in ΔOAB, we have [16]:…”
Section: Design Parametersmentioning
confidence: 99%
“…The center of the fiber should be positioned in such a way as to take into account the thickness of the polymer layers and the position of the guiding layer. According to figure 1(a) in ΔOAB, we have [16]:…”
Section: Design Parametersmentioning
confidence: 99%