2017
DOI: 10.1364/oe.25.024615
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Optical fabrication and characterisation of SU-8 disk photonic waveguide heterostructure cavities

Abstract: In order to demonstrate cavity quantum electrodynamics using photonic crystal (PhC) cavities fabricated around self-assembled quantum dots (QDs), reliable spectral and spatial overlap between the cavity mode and the quantum dot is required. We present a method for using photoresist to optically fabricate heterostructure cavities in a PhC waveguide with a combined photolithography and micro-photoluminescence spectroscopy system. The system can identify single QDs with a spatial precision of ±25 nm, and we confi… Show more

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Cited by 9 publications
(4 citation statements)
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“…To fabricate [47]. (e) and (f) illustrated a mode-gap cavity depicted in [86]. an SPE deterministically one needs to place a source spatially and spectrally at the antinode of a cavity mode.…”
Section: Deterministic Fabrication Of Spesmentioning
confidence: 99%
See 2 more Smart Citations
“…To fabricate [47]. (e) and (f) illustrated a mode-gap cavity depicted in [86]. an SPE deterministically one needs to place a source spatially and spectrally at the antinode of a cavity mode.…”
Section: Deterministic Fabrication Of Spesmentioning
confidence: 99%
“…One promising class of photonic crystal cavity design is the modulated mode-gap cavity [99]. One way of achieving such a cavity is to deposit a low refractive index material on top of a photonic crystal waveguide as shown in Fig 4e, f. The small photonic mode volume guarantees high Q cavities using an optical system, and thus greatly increases the probability of successful coupling between a QD and a cavity mode [86]. The lithography steps are straightforward, with a spatial precision of ±25 nm making the techniqure promising for scalable on-chip SPE systems [99].…”
Section: Deterministic Fabrication Of Spesmentioning
confidence: 99%
See 1 more Smart Citation
“…The SU-8 mould was prepared via a photolithographic process (16,17), while the PDMS array and cover slips were prepared by PDMS demoulding technology. The typical final step in preparing a closed chip for microfluidic experiments was accomplished using the bonding process (18,19). The chip was composed of an inlet, reaction chamber and an outlet; the reaction chamber was designed with an array of circular bypass columns in a staggered arrangement.…”
Section: Methodsmentioning
confidence: 99%