2017
DOI: 10.1109/jphotov.2017.2754060
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Optical Evaluation of Silicon Wafers With Rounded Rear Pyramids

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Cited by 10 publications
(3 citation statements)
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“…As the uniform formation of a perovskite film on a Si surface through solution processing is challenging, an additional process is required to flatten the Si surface, etch the pyramid using chemical rounding process, or reduce the pyramid size to several micrometers. [71][72][73] Regarding diffusion, the >300 nm thick diffusion profile of previously reported Si cells is unsuitable for tunneling, and a heavily doped semiconducting thin film should therefore be applied. Considering passivation layers, the available passivation technologies can be divided into defect-reduction, Coulombic-force, and carrier-selective ones.…”
Section: New Advanced Si Cellsmentioning
confidence: 99%
“…As the uniform formation of a perovskite film on a Si surface through solution processing is challenging, an additional process is required to flatten the Si surface, etch the pyramid using chemical rounding process, or reduce the pyramid size to several micrometers. [71][72][73] Regarding diffusion, the >300 nm thick diffusion profile of previously reported Si cells is unsuitable for tunneling, and a heavily doped semiconducting thin film should therefore be applied. Considering passivation layers, the available passivation technologies can be divided into defect-reduction, Coulombic-force, and carrier-selective ones.…”
Section: New Advanced Si Cellsmentioning
confidence: 99%
“…Because of the difference of measurement principle and accuracy, each measurement method has its own advantages and disadvantages. How to choose the testing instrument to adapt to different conditions for the detection and monitoring of silicon wafer surface quality is a common concern of all relevant personnel [13].…”
Section: Introductionmentioning
confidence: 99%
“…To address this issue, several groups have reported increased light trapping by applying the so-called pyramids-rounding approaches at the textured rear surface. This rounding effect is commonly implemented by chemical polishing in HNO3, which is an additional step in the device fabrication sequence [7,8]. This work focuses on the evaluation of ptype silicon epitaxial layers as rear side emitters in bifacial n-type silicon PERT (BiPERT) solar cells.…”
Section: Introductionmentioning
confidence: 99%