Optical emission spectroscopic study on H-assisted plasma for anisotropic deposition of Cu films

Deposition Profile Control of Carbon Films on Patterned Substrates using a Hydrogen-assited Plasma CVD Method

“…DLC films have widespread applications as protective coatings in several areas such as car parts, biomedical coatings and microelectromechanical systems (MEMS). We have succeeded in controlling deposition profile of Cu in trenches, and have realized sub-conformal, conformal and anisotropic deposition, for which Cu is filled preferentially from the bottom of trenches without sidewall deposition, using H-assisted plasma CVD method [6][7][8][9][10][11][12][13][14]. Recently, we have studied deposition profile of plasma CVD Cu films in trenches for nano-fabrications [6][7][8][9][10][11][12][13][14].…”