Optical Disk Mastering Using Optical Superresolution Technique

Shieh, Han–Ping D.; Tsai, Shih-Yaon; Peng, Yi-Hsing; Hsieh, Tsung−Eong

doi:10.1143/jjap.40.1671

Cited by 3 publications

(6 citation statements)

References 3 publications

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“…In the experiment involving line segment fabrication, the photoresist was spin‐coated onto the substrate, soft baked, and then exposed. Prior to development, an etching solution (HF:H 2 O 2 :H 2 O = 1:1:4) could be applied to remove the indium film without damaging the photoresist (Shieh et al, ). The parameters of the simulation were as follows:

Dill A = 9.481 \times 10^{- 4} normalL / nm

Dill B = 6.11 \times 10^{- 5} normalL / nm

Dill C = 1.64 \times 10^{6} {nm}^{2} / nJ

R_{max} = 132.26 nm / normals

R_{min} = 0.029 nm / normals

, and

w = 0.69

.…”

Section: Simulation Experiments and Analysis Of Line Segment Fabricatmentioning

confidence: 99%

“…Shieh et al . () and Tsai et al . () coated photoresist with indium (In) for use in photolithographic fabrication using far‐field lasers, successfully reducing fabrication width by approximately 40%.…”

Section: Introductionmentioning

confidence: 99%

“…Later, Kuwahara et al ('99) applied metal mask layers to optical master disks. Shieh et al (2001) and Tsai et al (2000) coated photoresist with indium (In) for use in photolithographic fabrication using far-field lasers, successfully reducing fabrication width by approximately 40%. They pointed out that the use of an etching solution (HF:H 2 O 2 :H 2 O = 1:1:4) enabled the removal of the indium film without damage to the photoresist.…”

Section: Introductionmentioning

confidence: 99%

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Using Gray‐Based Taguchi Method to Construct Multi‐Objective Optimal Model in Super‐Resolution Near‐Field Photolithography

Yang

Chiang²

2012

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This study integrated thermally induced super-resolution into near-field photolithography and conducted simulation and analysis on line segment fabrication. This technique involves passing a laser beam through an aluminum-plated optical fiber probe onto a thin film of indium (approximately 10 nm thick). The indium film opens a melted aperture narrower than the width of the laser beam, creating a melted region and a crystalline region. The difference in penetration rate between the two regions leads to the generation of thermally induced super-resolution. This paper proposes a combination of Taguchi method with gray relational analysis, in which S/N ratios obtained using the Taguchi method are converted into gray relational grades to identify an optimal combination of parameters capable of meeting multiple quality objectives. This optimal combination includes a probe aperture of 100 nm (A1), exposure energy/μm of 0.002nJ/μm (B2), development time of 60 s (C3), and indium film with a thickness of 7 nm (D1). The optimal parameters were (A1B2C3D1) for the gray relational analysis and (A1B1C1D1) for the Taguchi method. Results showed a negative improvement of -14.3% in line width from 126.2 (Taguchi method) to 144.2 nm (gray relational analysis). Working depth, however, showed a significantly improvement of 140.4% from 5.7 (Taguchi method) to 13.7 nm (gray relational analysis). The proposed approach resolves the conflicts that commonly occur among factor levels in Taguchi analysis under the requirements of multiple quality requirements.

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Dill A = 9.481 \times 10^{- 4} normalL / nm

Dill B = 6.11 \times 10^{- 5} normalL / nm

Dill C = 1.64 \times 10^{6} {nm}^{2} / nJ

R_{max} = 132.26 nm / normals

R_{min} = 0.029 nm / normals

, and

w = 0.69

.…”

Section: Simulation Experiments and Analysis Of Line Segment Fabricatmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Using Gray‐Based Taguchi Method to Construct Multi‐Objective Optimal Model in Super‐Resolution Near‐Field Photolithography

Yang

Chiang²

2012

Scanning

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show abstract

“…Later, Kuwahara et al 10 applied metal mask layers to optical master disks. Shieh et al 11 and Tsai et al 12 coated photoresist with indium (In) for use in photolithographic fabrication using far-field lasers, successfully reducing fabrication width by approximately 40%. They pointed out that the use of an etching solution (HF:H 2 O 2 :H 2 O = 1:1:4) enabled the removal of the indium film without damage to the photoresist.…”

Section: Introductionmentioning

confidence: 99%

Construction of a Line Segment Fabrication Model of Super-Resolution Near Field Photolithography and Parameters Analysis

Yang¹,

Chiang²

2013

j comput theor nanosci

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This study proposes a method to combine near field photolithography with thermal-induced superresolution and conducts simulation and analysis on line segment fabrication. The proposed technique involves passing a laser beam through an optical fiber probe plated with aluminum on a thin indium film (approximately 10 nm in thickness), which created a melted aperture narrower than width of the laser beam, leading to the formation of a melted region and a crystalline region. The penetration rates of each region differed, resulting in the generation of thermal-induced super resolution. This study divided the photoresist into finite nodes and the use of an exposure energy density model, an exposure model, and a development model enabled the simulation of widths and profiles of line segments fabricated with super-resolution NFP. Using the Taguchi method, the optimal combination of parameter levels for line segment fabrication with super-resolution near field photolithography was identified as A1B1C3D2. In addition, analysis of variance demonstrated that probe aperture (PA) has the greatest influence on line width (LW) during the experiment, with a contribution degree of 46.9%. Secondary to this influence was exposure energy/ m, with a contribution degree of 41.7%. The influences of development time (DT) and indium thickness (IT) were not apparent.

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“…Later, Kuwahara et al () applied metal mask layers to optical master disks. Shieh et al () and Tsai et al () coated photoresist with indium (In) for use in photolithographic fabrication using far‐field lasers, successfully reducing fabrication width by approximately 40%. They pointed out that the use of an etching solution (HF:H 2 O 2 :H 2 O = 1:1:4) enabled the removal of the indium film without damage to the photoresist.…”

Section: Introductionmentioning

confidence: 99%

Nanoscale Line Segment Fabrication Using Super‐Resolution Near‐Field Photolithography

Yang¹

2012

Scanning

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This study proposed a method to combine near-field photolithography (NFP) with thermally induced super-resolution, and conducted simulation and analysis on nanoscale line segment fabrication. A theoretical model of optical metal film was used to calculate the transmittance of indium film during line segment fabrication. A theoretical heat transfer model was employed to analyze the exposure power density on the surface of the photoresist after laser beams penetrated the indium film. This study divided the photoresist into finite nodes. Through a simulation combining an exposure energy density formula, an exposure model, and a developmental model, we derived the theoretical width and profile of the line segment fabricated using super-resolution NFP. The widths of the derived line segments were 88 nm for photoresist with indium coating and 130 nm without. The indium film accounted for a reduction in width of 32%.

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Optical Disk Mastering Using Optical Superresolution Technique

Cited by 3 publications

References 3 publications

Using Gray‐Based Taguchi Method to Construct Multi‐Objective Optimal Model in Super‐Resolution Near‐Field Photolithography

Using Gray‐Based Taguchi Method to Construct Multi‐Objective Optimal Model in Super‐Resolution Near‐Field Photolithography

Construction of a Line Segment Fabrication Model of Super-Resolution Near Field Photolithography and Parameters Analysis

Nanoscale Line Segment Fabrication Using Super‐Resolution Near‐Field Photolithography

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