Optical design of a vertically integrated array-type Mirau-based OCT system

Krauter, Johann; Boettcher, T.; Lyda, Wolfram; Passilly, Nicolas; Froehly, Luc; Bargiel, Sylwester; Albero, Jorge; Perrin, Stéphane; Lullin, Justine; Gorecki, Christophe

doi:10.1117/12.2054573

Cited by 12 publications

(7 citation statements)

References 13 publications

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“…If the conditions are relaxed to the Rayleigh criterion (RMS wavefront error < λ/4, considered sometimes in micro-optics qualification), the usable aperture diameter increases to about 80% for equivalent NA=0.05 and 90% for NA=0.02. These values of NA are of interest for a specific OCT application working at a wavelength of λ=850 nm [31]. Note that the fitting was reported only for lenses having sag<60 µm due to the limited NA of the MSA-500 optical profilometer.…”

Section: Characterization and Discussionmentioning

confidence: 99%

“…Also, integrated parallel inspection systems devoted to biomedical applications present similar or more demanding needs. To achieve high performances, these systems are designed with large apertures (around 2 mm) and arranged in dense matrices [31]. This is due to the need of inspecting relatively large zones, which is achieved by stitching the acquisition from adjacent channels.…”

Section: Introductionmentioning

confidence: 99%

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Dense arrays of millimeter-sized glass lenses fabricated at wafer-level

Albero¹,

Perrin²,

Bargiel³

et al. 2015

Opt. Express

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This paper presents the study of a fabrication technique of lenses arrays based on the reflow of glass inside cylindrical silicon cavities. Lenses whose sizes are out of the microfabrication standards are considered. In particular, the case of high fill factor arrays is discussed in detail since the proximity between lenses generates undesired effects. These effects, not experienced when lenses are sufficiently separated so that they can be considered as single items, are corrected by properly designing the silicon cavities. Complete topographic as well as optical characterizations are reported. The compatibility of materials with Micro-Opto-Electromechanical Systems (MOEMS) integration processes makes this technology attractive for the miniaturization of inspection systems, especially those devoted to imaging.

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Section: Characterization and Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Dense arrays of millimeter-sized glass lenses fabricated at wafer-level

Albero¹,

Perrin²,

Bargiel³

et al. 2015

Opt. Express

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show abstract

“…The overall opto-mechanical design of the OCT system aims the imaging a large surface of a tissue (8 x 8 mm 2 ) with a high lateral/axial resolution of 5-7 µm, penetration depth of 600 µm, all keeping a high level of system integration [11]. In order to fulfill these requirements, an array of 4 x 4 parallel-working Mirau microinterferometers was proposed ( Figure 1a).…”

Section: Concept Of Array-type Mirau Micro-interferometermentioning

confidence: 99%

Vertical comb-drive microscanner with 4x4 array of micromirrors for phase-shifting Mirau microinterferometry

et al. 2016

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In this paper, we present construction, fabrication and characterization of an electrostatic MOEMS vertical microscanner for generation of an optical phase shift in array-type interferometric microsystems. The microscanner employs asymmetric comb-drives for a vertical displacement of a large 4x4 array of reference micromirrors and for in-situ position sensing. The device is designed to be fully compatible with Mirau configuration and with vertical integration strategy. This enables further integration of the device within an "active" multi-channel Mirau micro-interferometer and implementation of the phase shifting interferometry (PSI) technique for imaging applications. The combination of micro-interferometer and PSI is particularly interesting in the swept-source optical coherence tomography, since it allows not only strong size reduction of a system but also improvement of its performance (sensitivity, removal of the image artefacts). The technology of device is based on double-side DRIE of SOI wafer and vapor HF releasing of the suspended platform. In the static mode, the device provides vertical displacement of micromirrors up to 2.8µm (0 -40V), whereas at resonance (fo=500 Hz), it reaches 0.7 µm for only 1VDC+1VAC. In both operation modes, the measured displacement is much more than required for PSI implementation (352nm peak-to-peak). The presented device is a key component of array-type Mirau micro-interferometer that enables the construction of portable, low-cost interferometric systems, e.g. for in vivo medical diagnostics.

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“…The OCT design is presented by J. Krauter et al 5 . The doublet of microlens array is fabricated at wafer level by reflow of glass 6 .…”

Section: Mirau Interferometermentioning

confidence: 99%

Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer

Wang¹,

Lullin

Froemel³

et al. 2015

SPIE Proceedings

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The paper presents the multi-wafer bonding technology as well as the integration of electrical connection to the z-scanner wafer of the micromachined array-type Mirau interferometer. A Mirau interferometer, which is a key-component of optical coherence tomography (OCT) microsystem, consists of a microlens doublet, a MOEMS Z-scanner, a focus-adjustment spacer and a beam splitter plate. For the integration of this MOEMS device heterogeneous bonding of Si, glass and SOI wafers is necessary. Previously, most of the existing methods for multilayer wafer bonding require annealing at high temperature, i.e., 1100 degrees C. To be compatible with MEMS devices, bonding of different material stacks at temperatures lower than 400 degrees C has also been investigated. However, if more components are involved, it becomes less effective due to the alignment accuracy or degradation of surface quality of the not-bonded side after each bonding operation. The proposed technology focuses on 3D integration of heterogeneous building blocks, where the assembly process is compatible with the materials of each wafer stack and with position accuracy which fits optical requirement. A demonstrator with up to 5 wafers bonded lower than 400 degrees C is presented and bond interfaces are evaluated. To avoid the complexity of through wafer vias, a design which creates electrical connections along vertical direction by mounting a wafer stack on a flip chip PCB is proposed. The approach, which adopts vertically-stacked wafers along with electrical connection functionality, provides not only a space-effective integration of MOEMS device but also a design where the Mirau stack can be further integrated with other components of the OCT microsystem easily

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Optical design of a vertically integrated array-type Mirau-based OCT system

Cited by 12 publications

References 13 publications

Dense arrays of millimeter-sized glass lenses fabricated at wafer-level

Dense arrays of millimeter-sized glass lenses fabricated at wafer-level

Vertical comb-drive microscanner with 4x4 array of micromirrors for phase-shifting Mirau microinterferometry

Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer

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