Optical Chip-to-Chip Link System by Using Optical Wiring Method for Reducing EMI

Cho, In‐Kui; Yun, Jae-Hoon; Jeong, Myung-Yung; Park, Hyo‐Hoon

doi:10.1109/tadvp.2010.2049018

Cited by 2 publications

(1 citation statement)

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“…For instance, polymers can be used to replace glass for fabricating optical fibers and conductive polymers can replace metals for electrical connections. Polymers may provide robust, continuous and cost-effective chip-to-chip interconnections [155]. Another benefit of polymers is the ease of processing for various devices [156].…”

Section: Cost Reduction Approachesmentioning

confidence: 99%

Low-Temperature Bonding for Silicon-Based Micro-Optical Systems

Howlader

Deen

2015

Photonics

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Abstract:Silicon-based integrated systems are actively pursued for sensing and imaging applications. A major challenge to realize highly sensitive systems is the integration of electronic, optical, mechanical and fluidic, all on a common platform. Further, the interface quality between the tiny optoelectronic structures and the substrate for alignment and coupling of the signals significantly impacts the system's performance. These systems also have to be low-cost, densely integrated and compatible with current and future mainstream technologies for electronic-photonic integration. To address these issues, proper selection of the fabrication, integration and assembly technologies is needed. In this paper, wafer level bonding with advanced features such as surface activation and passive alignment for vertical electrical interconnections are identified as candidate technologies to integrate different electronics, optical and photonic components. Surface activated bonding, superior to other assembly methods, enables low-temperature nanoscaled component integration with high alignment accuracy, low electrical loss and high transparency of the interface. These features are preferred for the hybrid integration of silicon-based micro-opto-electronic systems. In future, new materials and assembly technologies may emerge to enhance the performance of these micro systems and reduce their cost. The article is a detailed review of bonding techniques for electronic, optical and photonic components in silicon-based systems.

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Section: Cost Reduction Approachesmentioning

confidence: 99%