2009
DOI: 10.1016/j.jeurceramsoc.2008.07.008
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Optical characterization of stereolithography alumina suspensions using the Kubelka–Munk model

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Cited by 63 publications
(29 citation statements)
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References 15 publications
(15 reference statements)
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“…Originally developed for describing the light scattering within layers of turbid substances such as paint, the Kubelka-Munk model takes the changes in reflectance, transmittance and absorbance into account that arise when ceramic particles are added to the photocuring liquid. The value of the radiation energy released at a certain depth, z, inside the photocurable suspension with ceramic particles is given by the following relation: [229] E…”
Section: General Principlementioning
confidence: 99%
See 1 more Smart Citation
“…Originally developed for describing the light scattering within layers of turbid substances such as paint, the Kubelka-Munk model takes the changes in reflectance, transmittance and absorbance into account that arise when ceramic particles are added to the photocuring liquid. The value of the radiation energy released at a certain depth, z, inside the photocurable suspension with ceramic particles is given by the following relation: [229] E…”
Section: General Principlementioning
confidence: 99%
“…Thus, the reflectance term can be substituted by the reflective indices of the photocuring liquid, n 0 , and of the ceramic particles, n p . Moreover, the density of the optical medium can be included by the average size of the ceramic particles, d 50 , the wavelength of incoming light, l, and the interparticle spacing, F: [216,[229][230][231] …”
Section: General Principlementioning
confidence: 99%
“…More specifically, the modelling works of VP focus on the topology and dimensional accuracy ( [12][13][14] numerical) and mainly on the mechanical properties ( [16] analyticalempirical, [17][18][19][20][21] numerical and [21][22][23][24] empirical) and finally in [25] an analytical-empirical approach models heat transfer related issues.…”
Section: Vat Photopolymerization Processesmentioning
confidence: 99%
“…Process parameter (Variable) [12] Strain Temperature [13] Part shrinkage Thermal compensation, amorphous/crystalline polymer, mould material, cooling conditions [14] Deformation compensation [15] Dimensional Accuracy Layer thickness, part position on the platform, shrinkage compensation, retraction, hatch spacing, alternate hatching, blade gap, stagger weave [16] Cure depth Penetration depth of UV radiation, scattering coefficient [17][18][19] Etching, deposition, lithography mechanics Surface type, material, shape [20] Tool strength, ejection forces, decision about the quality of a tool according to the previous two [21] Separation force Pulling-up speed, others [22] Strength of parts Layer thickness, orientation, hatch spacing [22] Tensile, flexural and impact strength Layer thickness, orientation, hatch spacing [23] Part strength (tensile, impact, flexural) Layer thickness, post-curing time and orientation [24] Tensile strength, crystallographic orientationdensity analysis…”
Section: Kpimentioning
confidence: 99%
“…It is important to define how the depth of cure depends upon the energy dose and the characteristics of the powder-monomer solution-photoinitiator system. Several approaches have been taken, relating the depth of cure to the energy dose by modified Beer-Lambert 5 via Kubelka-Munk modeling 6 and by explicitly considering light scattering. 7,8 In this paper, we present a simple predictive model that considers several attenuation processes, including absorption by the photoinitiator, by an inert UV absorber, and attenuation by light scattering from suspended particles.…”
Section: Introductionmentioning
confidence: 99%