The hardness and Young's modulus dependences on the instrumented indentation depth profiles in Cu 6 PS 5 I single crystals and Cu 6 PS 5 I-based thin films were investigated. The measurements of mechanical parameters were performed at the room temperature by instrumented indentation in the continuous stiffness measurement mode with harmonic modulation of load during its linear increase. The variations of the hardness and Young's modulus in Cu 6 PS 5 І single crystals were interpreted in the framework of deformation gradient model. The decrease of micro-hardness in Cu 6 PS 5 I-based thin film observed with copper content increase was explained by formation of conductive clusters and dendrites.