Abstract:The open-tube diffusion of zinc in GaAs 0.8 P 0.2 from a zinc-doped silica film was investigated in detail. Aluminum nitride ͑AlN͒ and silicon nitride ͑SiN x ͒ films were used as the anneal caps. The dependence of diffusion depth on the thickness of an AlN-cap was found to differ from its dependence on SiN x -cap thickness. The selective masked diffusion of zinc using an AlN diffusion-mask was also systematically studied. The diffusion depth in selective masked diffusion was found to depend on both AlN-cap thi… Show more
A thermal annealing method was utilized in the diffusion process of Zn in the formation of the p-type layer on GaAs0.35P0.65 films. The thermal diffusion of Zn from the ZnO source film on the n-type substrate provides for the formation of a p-type layer and shows a stable signal of electroluminescence. The Zn diffusion mechanism was investigated by introducing two distinct processes of diffusion and reaction into the kick-out model involving Ga Frenkel defects at the diffusion front. The interstitial diffusion process requires an activation energy of 5.3 eV which is much larger than the substitutional reaction energy of 3.5 eV. The Zn diffusion process through the interstitial–substitutional exchange of Zn ions is governed by the diffusion-limited process. Furthermore, the Ga out-diffusion is related to the Frank–Turnbull model involving Schottky defects at the surface. The dissociation of the compositions of the GaAs0.35P0.65 layer into the GaAs-like phase on the film surface was observed by room-temperature photoluminescence.
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