“…100 Temperature control units are typically composed of microheaters/coolers, thermal sensors, and microcontrollers to form a close-looped control. Distinct strategies are adopted for integrating temperature control capability on the EWOD platform, namely, (1) placing heaters and sensors externally in the chip holding structures (system integration), 33,88,[97][98][99][100][101][102][103][104][105][106] (2) fabricating heaters and/or sensors on EWOD substrates (chip-scale integration), 57,89,[92][93][94]96,[107][108][109] and (3) using EWOD electrodes for multifunctional heating/sensing. 14,[110][111][112][113][114] For strategy (1), Shen et al 100 patterned a resistive microheater on a separate substrate (on the right) stacked and aligned with the EWOD bottom plate (on the left) (Fig.…”