One hundred fifty GHz folded dipole antenna‐on‐chip based on artificial magnetic conductor structure

Abstract

A folded dipole antenna using an artificial magnetic conductor (AMC) structure is proposed to improve the frequency bandwidth and reduce the size of the antenna on a chip. To change the distribution of the electromagnetic (EM) field, the proposed AMC structure shaped with square‐in‐square rings (SSRs) is arranged along the radiating metal of the folded dipole antenna and implemented on the lowermost metal layer of the backend oxide layers (BEOLs) between the radiating metal of the top layer of the BEOL and the ground plane of the bottom of the substrate. The SSR of the proposed antenna‐on‐chip (AoC) widens the frequency bandwidth by varying the electrical length to the ground and reduces the physical size of the radiating metal by increasing the effective permittivity. The 3D EM‐wave simulation shows that the proposed AMC structure changes the distribution of EM‐wave in the BEOL and Si substrate such that more EM fields are condensed around the radiating metal and the electrical length to the ground is nonuniform and longer. The AoC with the proposed AMC structure was fabricated using a 65‐nm standard complementary metal‐oxide semiconductor process with one‐poly and nine‐metal. Compared with the conventional 150‐GHz antenna that was implemented on the same die, the proposed differential antenna was measured to be a −10 dB bandwidth of 46 GHz, with a 1.12‐times improvement, and a size reduction of 20.4%. The measured gain of the proposed antenna was −5.99 dBi including the passive balun with an insertion loss of −1.36 dB in simulation.